Novità Dissipatori
DFRobot RDK X5 Metal Heatsink Case is a full-metal enclosure engineered specifically for the RDK X5 AI board. This case acts as a durable protective shell and a passive heatsink, safeguarding the delicate internal components while ensuring optimal thermal performance. The RDX X5 heatsink case features robust metal construction, efficient heat dissipation via direct contact with a thermal pad, and a precision-engineered design. This case is ideal for applications in robotics, electronics competitions, and any deployment where physical protection and stable operation are critical.
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DFRobot RDK X5 Metal Heatsink CaseProvides durable protection and superior heat management for the AI board.29/01/2026
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DFRobot LattePanda IOTA Aluminum Fanless Passive HeatsinkDesigned for silent, efficient cooling of the LattePanda IOTA single-board computer (SBC).13/01/2026 -
DFRobot LattePanda IOTA Aluminum Heatsink CaseEngineered to provide superior passive cooling and robust physical protection.23/12/2025 -
Advanced Thermal Solutions Heat Sinks for AMD Kria™ K24 SOMsMount directly to the clamshell thermal plate that comes standard with the K24 SOMs.22/10/2025 -
Toradex SMARC Heatsink Passive Type 1A comprehensive thermal solution mounted to the SMARC carrier board with six cross-slot screws.20/08/2025 -
Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMsDesigned to fit the K26 System-On-Module and include high-performance TIM and necessary hardware.06/03/2025 -
Rego Electronics Forged Heat SinksOffers a high aspect ratio of up to 1:100, increasing the surface heat dissipation area.11/02/2025 -
Toradex Aquila Heatsink Active Type 1Offers a complete thermal solution compatible with the Aquila AM69 and Aquila iMX95.01/10/2024 -
Seeed Studio Dissipatore di calore in alluminio con ventola (110991904)Offre funzioni di raffreddamento ad aria potenti per i moduli Jetson Orin™ NX/Orin™ Nano/Xavier NX.13/06/2024 -
Advanced Thermal Solutions POLARVrTX High-Capacity Active Cooling Heat SinksProvide high-capacity active cooling using air that outperforms liquid cooling options.31/05/2024 -
DFRobot LattePanda Mu HeatsinksMade of high-quality materials and designed specifically for the LattePanda Mu compute modules.22/04/2024 -
Advanced Thermal Solutions pcbCLIP Heat Sink w/ Tape-on PCB Attachment SystemTwo-part, tape-on system that features a heat sink.26/12/2023 -
Raspberry Pi Ventola/Dissipatore di calore attivo 5Dissipatore di calore in alluminio anodizzato monopezzo con ventola integrata per Raspberry Pi 5.09/10/2023 -
ADLINK Technology Modulo Express-ID7Basato sul processore Intel ® Xeon ® D-1700 con Ethernet ad alta velocità integrato per un massimo di 4 10 G.23/08/2023 -
Sunon EV Charger SolutionsPart of the renewable energy market and includes AC fans, DC fans, heat sinks, EC fans, and blowers.07/02/2023 -
Samtec Sistemi di cavi QSFP Flyover®Fornisce un'integrità del segnale migliorata ed estesa trasferendo i dati critici su materiali PCB dissipativi.13/09/2022 -
Samtec Sistemi di morsettiere per cavi Flyover®Estende la portata e la densità del segnale tramite cavi Twinax ultra-bassi per una soluzione alle sfide 56Gbps+.24/08/2022 -
TDK-Lambda Kit dissipatore di calore ACC-PX2X1Per l'uso con convertitori CC-CC PXD40/PXD60, include un dissipatore di calore, clip di montaggio e una piastra termica.16/08/2022 -
iBASE Technology IB952 AMD Ryzen™ V2000 3.5" Disk-Size SBCFeatures up to 8 cores and 16 threads to provide high computing performance and power efficiency.28/03/2022