congatec Dissipatori per CPU e chip

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congatec Dissipatori per CPU e chip Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
Scheda dati
8A magazzino
Min: 1
Mult.: 1

JUMPtec Dissipatori per CPU e chip COMe Active Uni Cooler (w/o HSP)
Scheda dati
Commenti sul prodotto
43A magazzino
Min: 1
Mult.: 1
14 mm 78 mm 87 mm 20 W
congatec HPC/sILH-CSA-HP-T
congatec Dissipatori per CPU e chip Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
Scheda dati
1A magazzino
Min: 1
Mult.: 1
32.9 mm 12 V
congatec Dissipatori per CPU e chip Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.
Scheda dati
2A magazzino
Min: 1
Mult.: 1

conga-MA7 Intel Elkhart Lake
congatec Dissipatori per CPU e chip *Passive cooling for Pico ITX module conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded
Scheda dati
2A magazzino
Min: 1
Mult.: 1
conga-PA7 Intel Elkhart Lake
congatec Dissipatori per CPU e chip Standard active cooling solution and integrated 12V fan for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 2A magazzino
Min: 1
Mult.: 1
27.3 mm 12 V conga-JC370
congatec Dissipatori per CPU e chip Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread
Scheda dati
11A magazzino
Min: 1
Mult.: 1

conga-TCA7 Intel Elkhart Lake
congatec Dissipatori per CPU e chip Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.
Scheda dati
5A magazzino
Min: 1
Mult.: 1

28 mm conga-HPC/cTLU Intel Tiger Lake-UP3
JUMPtec Dissipatori per CPU e chip HSK COMe-Basic active (w/o HSP)
Scheda dati
Commenti sul prodotto
7A magazzino
81In ordine
Min: 1
Mult.: 1
congatec Dissipatori per CPU e chip Standard active cooling solution and integrated 12V fan for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 3A magazzino
Min: 1
Mult.: 1
27.3 mm 12 V conga-JC370
congatec conga-TCR8/CSA-HP-B
congatec Dissipatori per CPU e chip Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole. 1A magazzino
Min: 1
Mult.: 1

congatec HPC/cALP-CSA-HP-B
congatec Dissipatori per CPU e chip Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. 1A magazzino
Min: 1
Mult.: 1
29 mm 12 V
JUMPtec Dissipatori per CPU e chip COMe Active Uni Cooler2 (w/o HSP)
Commenti sul prodotto
53A magazzino
Min: 1
Mult.: 1

JUMPtec 51099-0000-99-1
JUMPtec Dissipatori per CPU e chip SMARC Passive Uni Cooler (w/o HSP)
Commenti sul prodotto
105A magazzino
Min: 1
Mult.: 1
JUMPtec Dissipatori per CPU e chip HSP COMe-cAP6 Cu-core threaded
Scheda dati
Commenti sul prodotto
1In ordine
Min: 1
Mult.: 1

congatec conga-HPC/mRLP-CSA-B
congatec Dissipatori per CPU e chip Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Scheda dati
221/07/2026 previsto
Min: 1
Mult.: 1

congatec conga-HPC/mRLP-CSA-T
congatec Dissipatori per CPU e chip Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.
Scheda dati
221/07/2026 previsto
Min: 1
Mult.: 1

congatec conga-HPC/mRLP-CSP-B
congatec Dissipatori per CPU e chip Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Scheda dati
220/08/2026 previsto
Min: 1
Mult.: 1

congatec Dissipatori per CPU e chip Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are M2.5 threaded
Scheda dati
Tempo di consegna, se non a magazzino 12 settimane
Min: 1
Mult.: 1

conga-MA7 Intel Elkhart Lake
congatec Dissipatori per CPU e chip * Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole
Scheda dati
Tempo di consegna, se non a magazzino 8 settimane
Min: 1
Mult.: 1

conga-SA7 Intel Elkhart Lake
JUMPtec Dissipatori per CPU e chip HSP COMe-cAP6 Cu-core through
Scheda dati
Commenti sul prodotto
Non disponibile a magazzino
Min: 1
Mult.: 1

JUMPtec Dissipatori per CPU e chip COMe Passive Uni Cooler (w/o HSP)
Scheda dati
Commenti sul prodotto
N/A
Min: 1
Mult.: 1

14 mm 78 mm 87 mm
JUMPtec Dissipatori per CPU e chip COMe Passive Uni Cooler2 slim (w/o HSP)
Scheda dati
Commenti sul prodotto
Non disponibile a magazzino
Min: 1
Mult.: 1

JUMPtec Dissipatori per CPU e chip COMe Passive Uni Cooler2 (w/o HSP)
Scheda dati
Commenti sul prodotto
Non disponibile a magazzino
Min: 1
Mult.: 1

JUMPtec Dissipatori per CPU e chip HSK COMe-Basic passive (w/o HSP)
Scheda dati
Commenti sul prodotto
Tempo di consegna, se non a magazzino 28 settimane
Min: 1
Mult.: 1