Computer-On-Module - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

Computer-On-Module - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface

Dissipatori per CPU e chip COMe Active Uni Cooler (w/o HSP)

Schede e kit di sviluppo - ARM SMARC Evaluation Carrier 2.0

Schede e kit di sviluppo - x86 COMe Eval Carrier T7

Computer-On-Module - COM COM Express Type 6 Compact module based on Intel Core Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores P-cores 1.4Ghz up to 4.8GHz (turbo) E-Cores 0.9GHz up to 3.8GHz (turbo) Low Power E-cores up to 2.5GHz (turbo) Integra

Dissipatori per CPU e chip Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

Dissipatori HSP COMe-mAL10 E2 through

Dissipatori HSP COMe-mAL10 E2 slim thread

Dissipatori Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* With bore hole 2.7mm stand-offs.

Dissipatori Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.

Schede e kit di sviluppo - x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0