TE Connectivity ChipConnect Internal Cable Assemblies
TE Connectivity's ChipConnect Internal Faceplate-to-Processor Cable Assemblies are designed for Intel Omni-Path Architecture (OPA), which can directly transmit signals from the processor to the faceplate. ChipConnect cable assemblies mate directly with LGA 3647 sockets at the processor. The assemblies connect with Intel Omni-Path Internal Faceplate Transition (IFT) connector at the faceplate for 25Gbps speeds.
These cable assemblies reduce system design costs by eliminating the need to use costlier, lower-loss printed circuit board (PCB) materials. System design is made easier by reducing the complexity of PCB laminates and routing, as well as retimers.
Features
- Cables provide 4x and 8x high-speed data transmission lanes
- Straight and right-angle (left/right exit) Linear Edge Connector (LEC) cable plugs to accommodate cable routing
- LEC receptacle offered in A (mate to LGA 3647 socket PO) versions
- Bail latch will pull tab on LEC plug and spring latching on IFP plug provides secure connections
- Mid-board copper chip-to-I/O interconnect reduces host system board trace lengths and PCB cost
- Assemblies utilize TE bulk cable 30 AWG 85Ω TurboTwin 25Gbps primary pair cable
Applications
- Data Center & Networking Equipment
- Servers
- Routers
- High-Performance Computing (HPC)
Intel Omni-Path Architecture
Videos
Pubblicato: 2017-09-05
| Aggiornato: 2022-03-10