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ChipConnect Internal Cable Assemblies

TE Connectivity's ChipConnect Internal Faceplate-to-Processor Cable Assemblies are designed for Intel Omni-Path Architecture (OPA), which can directly transmit signals from the processor to the faceplate. ChipConnect cable assemblies mate directly with LGA 3647 sockets at the processor. The assemblies connect with Intel Omni-Path Internal Faceplate Transition (IFT) connector at the faceplate for 25Gbps speeds.

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Risultati: 2

Filtri applicati:

Estremità connettore A

Lunghezza del cavo

Genere

Ripristina tutto

Ricerca nei risultati

A magazzino

Normalmente a magazzino

Attivo

Nuovi prodotti

A norma RoHS

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