Moduli multiprotocollo

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Qtà RoHS Modello ECAD Serie
Frequenza
Potenza di uscita
Tipo di interfaccia
Tensione di alimentazione - Min.
Tensione di alimentazione - Max.
Temperatura di lavoro minima
Temperatura di lavoro massima
Tipo connettore antenna
Dimensioni
Protocollo - Bluetooth, BLE - 802.15.1
Protocollo - cellulare, Nbiot, LTE
Protocollo - GPS, GLONASS
Protocollo - Sub Ghz
Protocollo - Wi-Fi - 802.11
Protocollo - ANT, Thread, Zigbee - 802.15.4
Qualifica
Confezione
Intel Moduli multiprotocollo Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, No vPro
Scheda dati
97A magazzino
Min: 1
Mult.: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
Ezurio Moduli multiprotocollo BLE module BL653 (Nordic nRF52833) Trace pin (Tape/Reel)
Scheda dati
807A magazzino
Min: 1
Mult.: 1
: 1.000

BL653 2.4 GHz 8 dBm GPIO, I2C, I2S, SPI, UART, USB 1.7 V 5.5 V - 40 C + 105 C External 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 Thread Reel, Cut Tape
Ezurio Moduli multiprotocollo Module, Sterling LWB5+, M.2, Key E, SDIO, UART
Scheda dati
188A magazzino
Min: 1
Mult.: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO 3.3 V 3.3 V - 40 C + 85 C External 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Tray
Silicon Labs Moduli multiprotocollo MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Scheda dati
365A magazzino
Min: 1
Mult.: 1
: 1.000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Ezurio Moduli multiprotocollo 60 Series, Sterling Module w/u.FL, PCIE/UART
Scheda dati
195A magazzino
Min: 1
Mult.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm SDIO, UART 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Telink Moduli multiprotocollo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Scheda dati
3A magazzino
Min: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Ezurio Moduli multiprotocollo Sterling LWB+, Chip Antenna, CutTape
Scheda dati
1.140A magazzino
Min: 1
Mult.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C Chip 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Espressif Systems Moduli multiprotocollo SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 4 MB SPI flash, IPEX antenna connector.
Scheda dati
Altre informazioni disponibili

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Intel Moduli multiprotocollo Intel Wi-Fi 6 AX201 (Gig+), 1216, 2x2 AX+BT, vPro
Scheda dati
755A magazzino
Min: 1
Mult.: 1

Wi-Fi 6 AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 12 mm x 16 mm x 1.65 mm Bluetooth 5.2 802.11 ax
Microchip Technology Moduli multiprotocollo ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna
Scheda dati
130A magazzino
Min: 1
Mult.: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Silex Technology Moduli multiprotocollo [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108.
Scheda dati
15A magazzino
Min: 1
Mult.: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
NXP Semiconductors IW612UK/A1IZ
NXP Semiconductors Moduli multiprotocollo IW612UK/A1I
Scheda dati
25A magazzino
Min: 1
Mult.: 1
: 2.000

IW612HN Reel, Cut Tape
Silex Technology Moduli multiprotocollo [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f
Scheda dati
10A magazzino
Min: 1
Mult.: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
NXP Semiconductors IW611UK/A1IZ
NXP Semiconductors Moduli multiprotocollo IW611UK/A1I
Scheda dati
25A magazzino
Min: 1
Mult.: 1
: 2.000

IW611HN Reel, Cut Tape
Microchip Technology Moduli multiprotocollo SMARTCONNECT WINC3400 WL MOD
Scheda dati
767A magazzino
Min: 1
Mult.: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
DFRobot Moduli multiprotocollo ESP32-C3-MINI-1-N4 Module (PCB antenna)
15A magazzino
Min: 1
Mult.: 1
2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Bluetooth 5.0 802.11 b/g/n
Ezurio Moduli multiprotocollo Sterling LWB+, MHF4, Cut Tape
Scheda dati
85A magazzino
20022/02/2027 previsto
Min: 1
Mult.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C RF 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Intel Moduli multiprotocollo Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, vPro
Scheda dati
3A magazzino
Min: 1
Mult.: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax


ADLINK Technology Moduli multiprotocollo AMPAK AP12356 WIFI/BT KIT 2x2 Wi-Fi + Bluetooth4.1 Module with PCI-e Half-Mini CardIEEE802.11a/b/g/n/ac, PCI-e interfaceOperating Temperature: -10 70? Driver for Win/Linux/Android2pcs x Antenna + 2pcs x IPEX cable 2A magazzino
Min: 1
Mult.: 1
2.4 GHz, 5 GHz 16 dBm PCIe, USB 3 V 3.6 V - 10 C + 70 C External Bluetooth 802.11 a/b/g/n/ac
AcSiP Moduli multiprotocollo AI7931LD - Moduli multiprotocollo WIFI6 Dual Band 2.4/5GHz M33 SoC Module
Scheda dati
122A magazzino
Min: 1
Mult.: 1

WIFI 300 MHz ADC, GPIO, I2C, I2S, IR, PWM, SDIO, SPI, UART 2.97 V 3.63 V - 40 C + 85 C 32 mm x 32 mm x 2.7 mm Bluetooth 5.0 802.11 a/b/g/n/ac/ax Bag
Seeed Studio Moduli multiprotocollo The factory is currently not accepting orders for this product. 187A magazzino
Min: 1
Mult.: 1

2.4 GHz, 5 GHz USB 3.6 V 3.6 V u.FL 92 mm x 32 mm x 25 mm Bluetooth 5.0 802.11 b/g/n
Fortebit Moduli multiprotocollo Polaris 3G kit, includes: Polaris 3G board, aluminum case, GPS/Glonass/GSM antenna, main connector cable.
Scheda dati
5A magazzino
Min: 1
Mult.: 1

800 MHz, 850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.1 GHz 33 dBm I2C, SPI, UART 8 V 36 V - 35 C + 80 C SMA 3G GSM GLONASS, GPS
DFRobot Moduli multiprotocollo ESP32-C3-WROOM-02-N4 Module (PCB antenna) 26A magazzino
Min: 1
Mult.: 1
2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Bluetooth 5.0 802.11 b/g/n
NXP Semiconductors Moduli multiprotocollo IW610BUK/A1ZDI
Scheda dati
25A magazzino
Min: 1
Mult.: 1
: 2.000

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
Fortebit Moduli multiprotocollo Polaris 3G kit, includes: Polaris 3G board, aluminum case, GPS/Glonass/GSM antenna, main connector cable, LiPo battery.
Scheda dati
1A magazzino
Min: 1
Mult.: 1

800 MHz, 850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.1 GHz 33 dBm I2C, SPI, UART 8 V 36 V - 35 C + 80 C SMA 3G GSM GLONASS, GPS