Low Power HYPERRAM®

Winbond Low Power HYPERRAMs® are mobile DRAM with a high-speed SDRAM device internally configured as an 8-bank memory and uses a Double Data Rate (DDR) architecture on the Command/Address (CA) bus. This HYPERRAM features low pin count, low power consumption, and easy control to improve the performance of end devices. These IoT edge devices and human-machine interface devices require functionality in size, power consumption, and performance. These HYPERRAM memory devices provide technical solutions and address the rapid rise of IoT edge devices and human-machine interface devices. These HYPERRAMs offer 45mW power at 1.8V in hybrid sleep mode, significantly different from the standby mode of SDRAM. The HYPERRAM supports the HyperBus interface and is a solution to address the rapid rise of automotive electronics, industrial 4.0, and smart home applications.

Risultati: 3
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Tipo Dimensioni memoria Larghezza bus dati Frequenza di clock massima Package/involucro Organizzazione Tensione di alimentazione - Min. Tensione di alimentazione - Max. Temperatura di lavoro minima Temperatura di lavoro massima Confezione

Winbond DRAM 256Mb HyperRAM x8, 200MHz, Ind temp, 1.8V 480A magazzino
Min: 1
Mult.: 1
Max.: 100

HyperRAM 256 Mbit 8 bit 200 MHz 32 M x 8 1.7 V 1.95 V - 40 C + 85 C Tray

Winbond DRAM 256Mb HyperRAM x8, 200MHz, Ind temp, 1.8V, T&R 2.000A magazzino
Min: 1
Mult.: 1
Max.: 100
: 2.000

HyperRAM 256 Mbit 8 bit 200 MHz 32 M x 8 1.7 V 1.95 V - 40 C + 85 C Reel, Cut Tape
Winbond DRAM 128Mb HyperRAM x8, 200MHz, Ind temp, 1.8V, T&R 1.800A magazzino
Min: 1
Mult.: 1
Max.: 100
: 2.000

HyperRAM 128 Mbit 8 bit 200 MHz TFBGA-24 16 M x 8 1.7 V 2 V - 40 C + 85 C Reel, Cut Tape