Moduli multiprotocollo

Risultati: 247
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Serie Frequenza Potenza di uscita Tipo di interfaccia Tensione di alimentazione - Min. Tensione di alimentazione - Max. Temperatura di lavoro minima Temperatura di lavoro massima Tipo connettore antenna Dimensioni Protocollo - Bluetooth, BLE - 802.15.1 Protocollo - cellulare, Nbiot, LTE Protocollo - GPS, GLONASS Protocollo - Sub Ghz Protocollo - Wi-Fi - 802.11 Protocollo - ANT, Thread, Zigbee - 802.15.4 Confezione
Sierra Wireless Moduli multiprotocollo 5G RedCap module, industrial grade, LTE and GNSS based on Qualcomm's SDX35
199A magazzino
Min: 1
Mult.: 1

USB 3.135 V 4.4 V Tray
Embedded Artists Moduli multiprotocollo 2LL M.2 Module 39A magazzino
Min: 1
Mult.: 1

UART 3.3 V 3.46 V - 40 C + 85 C U.FL Bluetooth WiFi Bulk
u-blox Moduli multiprotocollo M.2 card with JODY-W263, in tray 195A magazzino
Min: 1
Mult.: 1

JODY-W2 2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 4.2 mm Bluetooth 5.2 Tray

Silicon Labs Moduli multiprotocollo Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), MVP, 78 MHz, 10 dBm 1.310A magazzino
Min: 1
Mult.: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Microchip Technology Moduli multiprotocollo ATWILC3000 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 2.225A magazzino
Min: 1
Mult.: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C Chip 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
u-blox Moduli multiprotocollo M.2 card with MAYA-W161, in tray 277A magazzino
Min: 1
Mult.: 1

MAYA-W1 2.4 GHz, 5 GHz 18 dBm I2S, PCIe, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 2.8 mm BLE, Bluetooth 5.2 802.11 a/b/g/n Tray
Inventek Moduli multiprotocollo 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. 2MB External Flash. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE 213A magazzino
Min: 1
Mult.: 1

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray

Espressif Systems Moduli multiprotocollo SMD module, ESP32-D0WD-V3, ESP32 ECO V3, 4 MB SPI flash, IPEX antenna connector, -40 C +105 C 2.501A magazzino
650In ordine
Min: 1
Mult.: 1

2.4 GHz 19.5 dBm I2C, I2S, PWM, SDIO, SPI, UART 3 V 3.6 V - 40 C + 105 C External 18 mm x 19 mm x 3.2 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray
Ezurio Moduli multiprotocollo 60 Series, Sterling Module w/u.FL, PCIE/UART 195A magazzino
Min: 1
Mult.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm SDIO, UART 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Espressif Systems Moduli multiprotocollo SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 4 MB SPI flash, IPEX antenna connector.

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Silex Technology Moduli multiprotocollo [Sample Pack] The SX-SDMAX-M2 is an M.2 2230 card that implements the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It features an MHF-I connector as an interface fo 7A magazzino
Min: 1
Mult.: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 22 mm x 4.45 mm x 30 mm Bulk
Embedded Artists Moduli multiprotocollo 1YM M.2 Wi-Fi 5 a/b/g/n/ac MU-MIMO, Bluetooth 5.2 with 88W8997 and LBEE5XV1YM 51A magazzino
Min: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, PCIe 3 V 3.6 V - 30 C + 85 C u.FL 22 mm x 30 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Pulse Electronics Moduli multiprotocollo USB 802.11 b/g/n BT module
746A magazzino
Min: 1
Mult.: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Silex Technology Moduli multiprotocollo [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f 10A magazzino
Min: 1
Mult.: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
CEL Moduli multiprotocollo CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 Half-size Mini-PCIe Card 2A magazzino
Min: 1
Mult.: 1

CMP9670 PCIe, USB Bluetooth Bulk
Microchip Technology Moduli multiprotocollo ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 130A magazzino
Min: 1
Mult.: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Adafruit Moduli multiprotocollo ESP32-C6-WROOM-1-N8 Engineering Module - 8 MB Quad SPI Flash - PCB Antenna 10A magazzino
Min: 1
Mult.: 1

Bulk
Ezurio Moduli multiprotocollo Module, Sterling LWB+, M.2, Key E, SDIO, UART 59A magazzino
Min: 1
Mult.: 1

Sterling-LWB+ 2.4 GHz USART 3.2 V 4.8 V - 40 C + 85 C MHF4 Bluetooth 5.2 WiFi 4, 802.11 b/g/n Tray
Microchip Technology Moduli multiprotocollo ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 815A magazzino
Min: 1
Mult.: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Silicon Labs Moduli multiprotocollo MGM13S02F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity 260A magazzino
Min: 1
Mult.: 1

MGM13S 2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C RF 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Tray
Telit Cinterion Moduli multiprotocollo 339A magazzino
Min: 1
Mult.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray
Telit Cinterion Moduli multiprotocollo 392A magazzino
Min: 1
Mult.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray
InnoPhase IoT Moduli multiprotocollo WiFi/BLE5/MCU Module w/ PCB Antenna 385A magazzino
Min: 1
Mult.: 1
2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C PCB 12.8 mm x 20 mm x 2.5 mm BLE 5.0 802.11 b/g/n Tray
Silicon Labs Moduli multiprotocollo 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified 772A magazzino
Min: 1
Mult.: 1

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Tray
Telit Cinterion Moduli multiprotocollo 181A magazzino
39229/06/2026 previsto
Min: 1
Mult.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.6 V 4.5 V - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Cellular, NBIoT, LTE GPS Tray