.050" LP Array™ Low Profile High-Density Arrays

Samtec .050 LP Array™ Low Profile, Open-Pin-Field High-Density Arrays feature a dual beam contact system on a 1.27mm x 1.27mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. The series is available in 4mm, 4.5mm, and 5mm mated heights with up to 320 total pins in 4-, 6- or 8-row configurations. These Samtec connectors support 28+ Gbps applications and are Final Inch® certified for Break Out Region trace routing recommendations to save time and be cost-effective. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

Risultati: 152
Seleziona Immagine Codice
 Produttore
Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità.
Qtà RoHS Modello ECAD Prodotto
Numero di posizioni
Passo
Numero di righe
Stile di terminazione
Angolo di montaggio
Altezza stack
Corrente nominale
Tensione nominale
Velocità dati massima
Temperatura di lavoro minima
Temperatura di lavoro massima
Placcatura del contatto
Materiale del contatto
Materiale di alloggiamento
Serie
Confezione
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
391A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
153A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
460A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 400 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
262A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
151A magazzino
2.10005/05/2026 previsto
Min: 1
Mult.: 1
Nastrati: 700

Sockets 40 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
2A magazzino
Min: 1
Mult.: 1
Nastrati: 550

LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
140A magazzino
Min: 1
Mult.: 1
Nastrati: 550

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
319A magazzino
Min: 1
Mult.: 1
Nastrati: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
289A magazzino
Min: 1
Mult.: 1
Nastrati: 300

LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
6A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 160 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
360A magazzino
Min: 1
Mult.: 1
Nastrati: 475

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
74A magazzino
Min: 1
Mult.: 1
Nastrati: 450

Headers 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
78A magazzino
Min: 1
Mult.: 1
Nastrati: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
33A magazzino
30002/03/2026 previsto
Min: 1
Mult.: 1
Nastrati: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
46A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
15A magazzino
Min: 1
Mult.: 1
Nastrati: 700

Sockets 40 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
Tempo di consegna, se non a magazzino 2 settimane
Min: 700
Mult.: 700
Nastrati: 700

LPAF Reel
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
Tempo di consegna, se non a magazzino 10 settimane
Min: 1
Mult.: 1
Nastrati: 700

LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
Tempo di consegna, se non a magazzino 10 settimane
Min: 700
Mult.: 700
Nastrati: 700

LPAF Reel
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
Tempo di consegna, se non a magazzino 4 settimane
Min: 475
Mult.: 475
Nastrati: 475

LPAF Reel
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
Tempo di consegna, se non a magazzino 3 settimane
Min: 700
Mult.: 700
Nastrati: 700

LPAF Reel
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
Tempo di consegna, se non a magazzino 10 settimane
Min: 1
Mult.: 1
Nastrati: 700
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda 1.27MM LP ARRAY HS HD ARRAY
Scheda dati
Tempo di consegna, se non a magazzino 10 settimane
Min: 700
Mult.: 700
Nastrati: 700

LPAF Reel
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
Tempo di consegna, se non a magazzino 3 settimane
Min: 650
Mult.: 650
Nastrati: 650

LPAF Reel
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Scheda dati
Tempo di consegna, se non a magazzino 11 settimane
Min: 650
Mult.: 650
Nastrati: 650
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel