.050" LP Array™ Low Profile High-Density Arrays

Samtec .050 LP Array™ Low Profile, Open-Pin-Field High-Density Arrays feature a dual beam contact system on a 1.27mm x 1.27mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. The series is available in 4mm, 4.5mm, and 5mm mated heights with up to 320 total pins in 4-, 6- or 8-row configurations. These Samtec connectors support 28+ Gbps applications and are Final Inch® certified for Break Out Region trace routing recommendations to save time and be cost-effective. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

Risultati: 152
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Prodotto Numero di posizioni Passo Numero di righe Stile di terminazione Angolo di montaggio Altezza stack Corrente nominale Tensione nominale Velocità dati massima Temperatura di lavoro minima Temperatura di lavoro massima Placcatura del contatto Materiale del contatto Materiale di alloggiamento Serie Confezione
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 117A magazzino
Min: 1
Mult.: 1
Nastrati: 350

Sockets 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 781A magazzino
Min: 1
Mult.: 1
Nastrati: 500

Sockets 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 582A magazzino
Min: 1
Mult.: 1
Nastrati: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 178A magazzino
Min: 1
Mult.: 1
Nastrati: 325

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 387A magazzino
Min: 1
Mult.: 1
Nastrati: 550

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 272A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 390A magazzino
Min: 1
Mult.: 1
Nastrati: 500

Sockets 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 2.2 A 250 VAC Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 151A magazzino
Min: 1
Mult.: 1
Nastrati: 700

Sockets 40 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda 1.27MM LP ARRAY HS HD ARRAY 325A magazzino
Min: 1
Mult.: 1
Nastrati: 325
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 460A magazzino
Min: 1
Mult.: 1
Nastrati: 550
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 260A magazzino
Min: 1
Mult.: 1
Nastrati: 550

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 206A magazzino
Min: 1
Mult.: 1
Nastrati: 500

Sockets 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 464A magazzino
Min: 1
Mult.: 1
Nastrati: 550

Sockets 24 Position 1.27 mm (0.05 in) 6 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 377A magazzino
Min: 1
Mult.: 1
Nastrati: 350

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 149A magazzino
Min: 1
Mult.: 1
Nastrati: 325

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 130A magazzino
Min: 1
Mult.: 1
Nastrati: 325

Sockets 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 318A magazzino
Min: 1
Mult.: 1
Nastrati: 350
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 1.268A magazzino
Min: 1
Mult.: 1
Nastrati: 625

Headers 40 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 322A magazzino
Min: 1
Mult.: 1
Nastrati: 475

Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 162A magazzino
Min: 1
Mult.: 1
Nastrati: 325

LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 203A magazzino
Min: 1
Mult.: 1
Nastrati: 450

Headers 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 215A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 227A magazzino
Min: 1
Mult.: 1
Nastrati: 475

Plugs 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 99A magazzino
Min: 1
Mult.: 1
Nastrati: 325

Headers 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 175A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape