200-LPAM Connettori Mezzanine scheda-scheda

Risultati: 113
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Prodotto Numero di posizioni Passo Numero di righe Stile di terminazione Angolo di montaggio Altezza stack Corrente nominale Tensione nominale Velocità dati massima Temperatura di lavoro minima Temperatura di lavoro massima Placcatura del contatto Materiale del contatto Materiale di alloggiamento Serie Confezione
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 178A magazzino
Min: 1
Mult.: 1
Nastrati: 325

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 272A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 180 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 203A magazzino
Min: 1
Mult.: 1
Nastrati: 450

Headers 80 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 175A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 262A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 153A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 162A magazzino
Min: 1
Mult.: 1
Nastrati: 325

LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 1.268A magazzino
Min: 1
Mult.: 1
Nastrati: 625

Headers 40 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 460A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 400 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 215A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec LPAM-30-01.0-S-06-1-K-TR
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 275A magazzino
Min: 1
Mult.: 1
Nastrati: 325
Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 74A magazzino
Min: 1
Mult.: 1
Nastrati: 450

Headers 120 Position 1.27 mm (0.05 in) 4 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 360A magazzino
Min: 1
Mult.: 1
Nastrati: 475

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 46A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 289A magazzino
Min: 1
Mult.: 1
Nastrati: 300

LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 33A magazzino
30002/03/2026 previsto
Min: 1
Mult.: 1
Nastrati: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 6A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 160 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 391A magazzino
Min: 1
Mult.: 1
Nastrati: 300

Headers 320 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4.5 mm, 5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 99A magazzino
Min: 1
Mult.: 1
Nastrati: 325

Headers 240 Position 1.27 mm (0.05 in) 8 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 322A magazzino
Min: 1
Mult.: 1
Nastrati: 475

Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 307A magazzino
Min: 1
Mult.: 1
Nastrati: 300

LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 227A magazzino
Min: 1
Mult.: 1
Nastrati: 475

Plugs 120 Position 1.27 mm (0.05 in) 4 Row Crimp Straight 2.2 A 250 VAC Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 78A magazzino
Min: 1
Mult.: 1
Nastrati: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Crimp Vertical 4 mm, 4.5 mm 2.2 A 250 VAC 28 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel, Cut Tape
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Tempo di consegna, se non a magazzino 10 settimane
Min: 450
Mult.: 450
Nastrati: 450

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel
Samtec Connettori Mezzanine scheda-scheda .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Tempo di consegna, se non a magazzino 4 settimane
Min: 450
Mult.: 450
Nastrati: 450

Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAM Reel