e.MMC v5.1 Embedded Flash Storage Solution

ATP Electronics e.MMC v5.1 Embedded Flash Storage Solution integrates NAND flash memory, a sophisticated flash controller, and a fast MultiMedia Card (MMC) interface. By incorporating these components in an integrated package, ATP e.MMC manages all background operations internally. This frees the host from handling low-level flash operations for faster and more efficient processing.

Risultati: 32
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Serie Package/involucro Dimensioni memoria Configurazione Lettura sequenziale Scrittura sequenziale Tipo di interfaccia Temperatura di lavoro minima Temperatura di lavoro massima
ATP Electronics eMMC AEC-Q100 Grade 2 -40C to +105C 11.5x13 3D MLC eMMC 441A magazzino
Min: 1
Mult.: 1
E700Paa FBGA-153 32 GB PSLC 300 MB/s 240 MB/s eMMC 5.1 HS400 - 40 C + 105 C
ATP Electronics eMMC AEC-Q100 Grade 3 -40C to +85C 11.5x13 3D MLC eMMC 760A magazzino
Min: 1
Mult.: 1
E700Pia FBGA-153 32 GB PSLC 300 MB/s 240 MB/s eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC I-Temp. -40C to +85C 11.5x13 3D MLC eMMC 8A magazzino
760In ordine
Min: 1
Mult.: 1
E700Pi FBGA-153 8 GB PSLC 300 MB/s 240 MB/s eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC I-Temp. -40C to +85C 11.5x13 3D MLC eMMC 3A magazzino
Min: 1
Mult.: 1
E700Pi FBGA-153 16 GB PSLC 300 MB/s 240 MB/s eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC AEC-Q100 Grade 3 -40C to +85C 11.5x13 3D MLC eMMC 6A magazzino
Min: 1
Mult.: 1
E700Pia FBGA-153 16 GB PSLC 300 MB/s 240 MB/s eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC Extended I-Temp. -40C to +105C 11.5x13 3D MLC eMMC 1A magazzino
Min: 1
Mult.: 1
E600Sa FBGA-153 16 GB MLC - 40 C + 105 C
ATP Electronics eMMC Extended I-Temp. -40C to +105C 11.5x13 3D MLC eMMC 7A magazzino
Min: 1
Mult.: 1
E700Pa FBGA-153 32 GB SLC - 40 C + 105 C
ATP Electronics eMMC I-Temp. -40C to +85C 11.5x13 3D MLC eMMC 6A magazzino
Min: 1
Mult.: 1
E700Pi FBGA-153 32 GB SLC - 40 C + 85 C
ATP Electronics eMMC AEC-Q100 Grade 2 -40C to +105C 11.5x13 3D MLC eMMC 10A magazzino
Min: 1
Mult.: 1
E600Saa FBGA-153 32 GB MLC 300 MB/s 170 MB/s eMMC 5.1 HS400 - 40 C + 105 C
ATP Electronics eMMC I-Temp. -40C to +85C 11.5x13 3D MLC eMMC 30A magazzino
Min: 1
Mult.: 1
E600Si FBGA-153 32 GB MLC - 40 C + 85 C
ATP Electronics eMMC Industrial Temp. -40C to +85C 11.5x13 TLC eMMC 2A magazzino
Min: 1
Mult.: 1
E600Si FBGA-153 32 GB TLC 290 MB/s 220 MB/s eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC I-Temp. -40C to +85C 11.5x13 3D MLC eMMC 20A magazzino
Min: 1
Mult.: 1
E700Pi FBGA-153 64 GB PSLC 300 MB/s 240 MB/s eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC I-Temp. -40C to +85C 11.5x13 3D MLC eMMC
47410/08/2026 previsto
Min: 1
Mult.: 1
E600Si FBGA-153 16 GB MLC - 40 C + 85 C
ATP Electronics eMMC AEC-Q100 Grade 2 -40C to +105C 11.5x13 3D MLC eMMC Tempo di consegna, se non a magazzino 29 settimane
Min: 760
Mult.: 760
E700Paa FBGA-153 8 GB PSLC 300 MB/s 240 MB/s eMMC 5.1 HS400 - 40 C + 105 C
ATP Electronics eMMC AEC-Q100 Grade 3 -40C to +85C 11.5x13 3D MLC eMMC Tempo di consegna, se non a magazzino 29 settimane
Min: 760
Mult.: 760
E700Pia FBGA-153 8 GB PSLC 300 MB/s 240 MB/s eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC Extended I-Temp. -40C to +105C 11.5x13 3D MLC eMMC Tempo di consegna, se non a magazzino 29 settimane
Min: 1
Mult.: 1
E700Pa FBGA-153 8 GB SLC - 40 C + 105 C
ATP Electronics eMMC AEC-Q100 Grade 2 -40C to +105C 11.5x13 3D MLC eMMC Tempo di consegna, se non a magazzino 29 settimane
Min: 760
Mult.: 760
E700Paa FBGA-153 16 GB PSLC 300 MB/s 170 MB/s eMMC 5.1 HS400 - 40 C + 105 C
ATP Electronics eMMC Extended I-Temp. -40C to +105C 11.5x13 3D MLC eMMC Tempo di consegna, se non a magazzino 29 settimane
Min: 760
Mult.: 760
E700Pa FBGA-153 16 GB PSLC 300 MB/s 240 MB/s eMMC 5.1 HS400 - 40 C + 105 C
ATP Electronics eMMC AEC-Q100 Grade 2 -40C to +105C 11.5x13 3D MLC eMMC Tempo di consegna, se non a magazzino 29 settimane
Min: 760
Mult.: 760
E600Saa FBGA-153 16 GB MLC 300 MB/s 170 MB/s eMMC 5.1 HS400 - 40 C + 105 C
ATP Electronics eMMC AEC-Q100 Grade 3 -40C to +85C 11.5x13 3D MLC eMMC Tempo di consegna, se non a magazzino 29 settimane
Min: 1
Mult.: 1
E600Sia FBGA-153 16 GB MLC 300 MB/s 170 MB/s eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC AEC-Q100 Grade 3 -40C to +85C 11.5x13 3D MLC eMMC Tempo di consegna, se non a magazzino 29 settimane
Min: 760
Mult.: 760
E600Sia FBGA-153 32 GB MLC 300 MB/s 170 MB/s eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC Extended I-Temp. -40C to +105C 11.5x13 3D MLC eMMC Tempo di consegna, se non a magazzino 29 settimane
Min: 760
Mult.: 760
E600Sa FBGA-153 32 GB MLC 300 MB/s 170 MB/s eMMC 5.1 HS400 - 40 C + 105 C
ATP Electronics eMMC AEC-Q100 Grade 3 -40C to +85C 11.5x13 3D MLC eMMC Tempo di consegna, se non a magazzino 29 settimane
Min: 760
Mult.: 760
E700Pia FBGA-153 64 GB PSLC 300 MB/s 240 MB/s eMMC 5.1 HS400 - 40 C + 85 C
ATP Electronics eMMC Extended I-Temp. -40C to +105C 11.5x13 3D MLC eMMC Tempo di consegna, se non a magazzino 29 settimane
Min: 760
Mult.: 760
E700Pa FBGA-153 64 GB PSLC 300 MB/s 240 MB/s eMMC 5.1 HS400 - 40 C + 105 C
ATP Electronics eMMC AEC-Q100 Grade 2 -40C to +105C 11.5x13 3D MLC eMMC Tempo di consegna, se non a magazzino 29 settimane
Min: 760
Mult.: 760
E600Saa FBGA-153 64 GB MLC 300 MB/s 170 MB/s eMMC 5.1 HS400 - 40 C + 105 C