TE Connectivity MULTI-BEAM Card Edge Connectors
TE Connectivity's MULTI-BEAM Card Edge Connectors deliver leading power and signal performance to address server market requirements for performance, profile, and cost-effectiveness. These connectors are also ideal for global data communication applications. TE MULTI-BEAM Card Edge Connectors offer signal space savings of up to 60% compared to existing SEC-II power card edge designs and a 30% power density improvement over legacy products. This TE card edge connector series also offers a current rating of 43A maximum for power contacts. The scalable and modular features of these connectors support high flexibility in configuration and PCB design.
Features
- High density
- Up to 60% signal space savings
- 30% power density improvement over legacy products
- High Connectivity tolerance
- High gatherability for blind-mate applications, ±2.0mm (X), ±1.54mm (Y)
- More clearance between PCB pads for signal contact to prevent solder bridging and 1.3mm larger pads for easier alignment
- Supports 1.57mm and 2.36mm PCB thickness
- Modular design
- Common power and signal contact module
- Flexible configuration with different contact quantities and positions
- High scalability (AC and DC, low power and high power)
- High performance
- Excellent mechanical and electrical performance
- Easy mating/un-mating with proper retention force
- Low-level contact resistance
Specifications
- Current rating
- Up to 43A (power contact)
- Up to 2A (signal contact)
- Voltage rating
- 100V maximum (power)
- 60V maximum (signal)
- 200 mating cycles durability
- EIA-364-27 mechanical shock
- EIA-364-28 vibration
- -55°C to +105°C operating temperature range
- Low mating force
- 6N maximum per power contact
- 1.5N maximum per signal contact
Applications
- Datacenter
- Telecommunications
- Industrial automation
- Power systems
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