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Hirose Electric DXM High-Density I/O Connectors

Hirose Electric DXM High-Density I/O Connectors come with bellow contacts that are suitable for miniaturized electronic devices. These connectors incorporate 1.27mm interconnect design that ensures positive locking, effortless coupling, terminal protection, and EMI reduction in a miniaturized and rugged package. The DXM connectors offer a variety of high-density connectors that include IDC and solder for the plug, right-angle dip, and the straight dip. Hirose DXM High-Density I/O Connectors also provide IDC and SMT for the receptacle. DXM Connectors are available in 14- to 110-way. Typical applications include office automation, computers, measurement, factory automation, home automation, and communication and control equipment.

Features

  • 1.27mm contact spacing that conserves valuable board space and permits high-density designs
  • Bellow contacts to create smooth and precise mating and unmating
  • Unique shell design
  • IDC termination that allows quick and low-cost termination to AWG #28 wires
  • Ferrite added to DX right-angle dip type for EMI protection
  • Die-cast Zinc alloy or stainless steel that reduces the penetration of the external EMI noise
  • Overmold backshell for ESD protection in one-touch locking and screw locking
  • Termination methods are available in IDC, soldering, right-angle dip, straight dip, and SMT

Applications

  • Office automation
  • Computers
  • Measurement
  • Communication and control equipment
  • Factory automation
  • Home automation

Specifications

  • 0.5A current capacity
  • 125VAC rated voltage
  • ≥250MΩ insulation resistance at 100VDC
  • ≤35mΩ contact resistance at 100mA DC current
  • 300Vrms AC withstanding voltage for 1-minute
Pubblicato: 2019-07-07 | Aggiornato: 2023-04-05