Aavid, Thermal Division of Boyd Corporation Board Level Cooling – Plug-In 5728

Aavid, Thermal Division of Boyd Corporation Board Level Cooling – Plug-In 5728 are plug-in channel board-level heatsinks designed to cool TO‐220 devices. These heatsinks provide a cost-effective solution to add surface area for increased heat transfer for board-level products. The board level cooling – plug-in 5728 heatsinks are formed through progressive punching processes. In this process, the details and features are progressively added with each stamp of sheet metal going through the punching die. These heat sinks come in a variety of mounting methods, including solder tabs and pins, interference fit with the device through integrated clips or slide-on features, or through-hole hardware like screws and nuts. The board level cooling – plug-in 5728 heatsinks are capable of meeting specific installation needs with a wide variety of mounting configurations.

Features

Designed to cool TO‐220 devices
Cost-effective solution to add surface area for increased heat transfer for board-level products
Formed through progressive punching processes
Come in a variety of mounting methods:
- Solder tabs and pins
- Interference fit with the device through integrated clips or slide-on features
- Through-hole hardware like screws and nuts

Available with a finish to improve heat radiation and thermal performance for natural convection applications
Improved performance:
- Improve heat dissipation, device performance, and speed with the added surface area
Longer product lifetimes:
- Increase device reliability and product lifetimes with passive air cooling