Aavid, Thermal Division of Boyd Corporation Sil-Free Plus Non-Silicone Thermal Grease
Aavid, Thermal Division of Boyd Corporation Sil-Free Plus Non-Silicone Thermal Grease offers leading low thermal resistance for thin bond line applications. Aavid Boyd Sil-Free Plus Grease offers high durability and no pump-out, making it ideal for applications requiring extended life and no degradation. Sil-Free Plus is designed to be applied where thermal coupling is required and where a device may need to be removed from the heat sink at a later time. Applications include central processing units/graphics processing units (CPUs/GPUs), power semiconductors, and LEDs. The series is also an efficient and cost-effective solution for thermal management applications.
Thermal grease is used when applying two surfaces together. When the surfaces are pressed together using Sil-Free grease, the grease spreads out thinly. This process gives the user an advantage in thermal management. The thinner the material between the two surfaces, the less resistance the interface material will impose on heat transfers. These benefits make the use of grease ideal for flat and smooth surfaces.
Features
- High conductivity
- Low thermal resistance
- Non-silicone based
- Non-reactive
- Non-abrasive
- Thixotropic behavior and excellent dielectric properties
- Zero pump-out
Applications
- CPUs and GPUs
- Power semiconductors and LEDs
- Thermal management
- Industrial
- Transportation
Specifications
- 1.4W/m-K thermal conductivity at +36°C
- 0.0310°C/W thermal resistance at +50°C
- 265V/mil dielectric strength, 0.05" gap
- 5.02 dielectric constant, +25°C at 1000Hz
- 7g/min to 10g/min flow rate
- Two-year shelf life
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Pubblicato: 2020-11-19
| Aggiornato: 2022-09-26