3M Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.


  • High thermal conductivity
  • Good electrical insulation properties
  • Good softness and conformability even to non-flat surfaces
  • Slight tack allows pre-assembly
  • Good wet-ability for improved and lower thermal resistance


  • Integrated Circuit (IC) chip packaging heat conduction
  • Heat sink interface
  • COF heat conduction
  • LED board TIM
  • HD TV IC chip
  • General gap filling in electronic devices
Pubblicato: 2019-03-24 | Aggiornato: 2023-05-08