Lattice Semiconductor MachXO2 Programmable Logic Devices (PLDs)

Lattice Semiconductor MachXO2 Programmable Logic Devices (PLDs) consist of six ultra-low power, instant-on, non-volatile PLDs that offer densities ranging from 256 to 6864 Look-Up Tables (LUTs). In addition, the MachXO2 family of PLDs from Lattice Semiconductor offer several features such as Embedded Block RAM (EBR), Distributed RAM, and User Flash Memory (UFM), which allow these devices to be used in low cost, high volume consumer and system applications. 

The MachXO2 devices are designed on a 65nm non-volatile low power process and are available in two versions - ultra low power (ZE) and high performance (HC and HE). MachXO2s are also available in a broad range of advanced halogen-free packages and offer enhanced I/O features such as drive strength control, slew rate control, PCI compatibility, bus-keeper latches, and pull-up resistors. The MachXO2 also provides flexible, reliable and secure configuration from on-chip Flash memory.

Lattice has expanded its offering of MachXO2 PLDs with the MachXO2-4000 series of PLDs.

Features

  • Flexible logic architecture:
    • Six devices with 256 to 6864 LUT4s and 19 to 335 I/Os
  • Ultra low power devices:
    • Advanced 65nm low power process
    • As low as 19µW standby power
  • Embedded and distributed memory:
    • Up to 240 Kbits sysMEM™ Embedded block RAM
    • Up to 54 Kbits distributed RAM
  • On-chip user flash memory:
    • Up to 256 Kbits of user flash memory
    • 100,000 write cycles
  • Pre-engineered source synchronous I/O:
    • DDR registers in I/O cells
    • Dedicated gearing logic
  • High-performance and flexible I/O Buffer:
    • Programmable sysIO™ buffer supports a wide range of interfaces:
    • LVCMOS 3.3/2.5/1.8/1.5/1.2
    • LVTTL
    • PCI
    • LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL
    • SSTL 25/18
    • HSTL 18
    • Schmitt trigger inputs, up to 0.5V hysteresis
  • Flexible on-chip clocking:
    • Eight primary clocks
    • Up to two edge clocks for high-speed I/O
  • Non-volatile, infinitely reconfigurable
    • Instant-on - powers up in microseconds
    • Single-chip, secure solution
  • TransFR™ reconfiguration
    • In-field logic update while the system operates
  • Enhanced System-Level support:
    • On-chip hardened functions: SPI, I2C, timer/counter
    • On-chip oscillator with 5.5% accuracy
  • Broad range of package options
    • TQFP, WLCSP, ucBGA, csBGA, caBGA, ftBGA, fpBGA package options
    • Small footprint package options - as small as 2.5mm x 2.5mm
Pubblicato: 2012-03-23 | Aggiornato: 2022-03-11