M7 Moduli multiprotocollo

Risultati: 1.643
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Serie Frequenza Potenza di uscita Tipo di interfaccia Tensione di alimentazione - Min. Tensione di alimentazione - Max. Temperatura di lavoro minima Temperatura di lavoro massima Tipo connettore antenna Dimensioni Protocollo - Bluetooth, BLE - 802.15.1 Protocollo - cellulare, Nbiot, LTE Protocollo - GPS, GLONASS Protocollo - Sub Ghz Protocollo - Wi-Fi - 802.11 Protocollo - ANT, Thread, Zigbee - 802.15.4 Qualifica Confezione
Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1.00023/10/2026 previsto
Min: 1
Mult.: 1
: 1.000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1.07026/08/2026 previsto
Min: 1
Mult.: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
2.86001/09/2026 previsto
Min: 1
Mult.: 1
: 1.000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Moduli multiprotocollo SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
200In ordine
Min: 1
Mult.: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Wurth Elektronik Moduli multiprotocollo WIRL-NFW2 Orthosie-I w/o firmware-with RFplug w/ FL & RF shield 9.0x13.0x2.0mm
50026/02/2027 previsto
Min: 1
Mult.: 1
: 500

WIRL-NFW2 2.472 GHz, 2.48 GHz 21 dBm ADC, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 13 mm x 9.5 mm x 2 mm Bluetooth LE WiFi Reel, Cut Tape, MouseReel
Murata Electronics Moduli multiprotocollo Type 1SJ Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 6.2
99924/02/2027 previsto
Min: 1
Mult.: 1
: 1.000

1SJ 868 MHz, 915 MHz 21.5 dBm UART - 40 C + 85 C 10 mm x 8 mm x 1.6 mm LoRa/LoRaWAN Reel, Cut Tape
Telit Cinterion Moduli multiprotocollo
38721/09/2026 previsto
Min: 1
Mult.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm NBIoT, LTE GPS, GLONASS Tray
Digi Moduli multiprotocollo Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, AT&T SIM
2531/08/2026 previsto
Min: 1
Mult.: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Embedded Artists Moduli multiprotocollo 2GF M.2 Module
4530/10/2026 previsto
Min: 1
Mult.: 1

2.4 GHz to 5 GHz 4-Wire UART, SDIO 3.15 V 3.46 V - 20 C + 70 C u.FL 802.11 a/b/g/n/ac Bulk
Embedded Artists Moduli multiprotocollo 2FY M.2 Module
49In ordine
Min: 1
Mult.: 1

2.4 GHz to 2.484 GHz 9 dBm Audio, SDIO, UART 3.15 V 3.46 V - 40 C + 85 C U.FL Bluetooth 5.0 802.11a/b/g/n/ac/ax, 6/6E Bulk
Intel BE200.NGWG.NVX
Intel Moduli multiprotocollo Intel Killer Wi-Fi 7 BE1750 x, 2230, 2x2 BE+BT, No vPro
10024/08/2026 previsto
Min: 1
Mult.: 1

BE200
Insight SiP Moduli multiprotocollo nRF52832 LoRa Transceiver & BLE 5 Module AS
10025/09/2026 previsto
Min: 1
Mult.: 1
920 MHz to 923 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
Seeed Studio Moduli multiprotocollo Seeed Studio XIAO ESP32-C5 (Pre-Soldered)
123In ordine
Min: 1
Mult.: 1

GPIO, I2C, SPI, UART, USB
Seeed Studio Moduli multiprotocollo Seeed Studio XIAO nRF52840(Tape & Reel)
51In ordine
Min: 1
Mult.: 1

Seeed Studio Moduli multiprotocollo Seeed Studio XIAO nRF52840 Sense(Tape & Reel)
54In ordine
Min: 1
Mult.: 1

Seeed Studio Moduli multiprotocollo Seeed Studio XIAO ESP32-C6(Tape & Reel)
5831/08/2026 previsto
Min: 1
Mult.: 1

Seeed Studio Moduli multiprotocollo Wio Tracker L1
211/09/2026 previsto
Min: 1
Mult.: 1

Seeed Studio Moduli multiprotocollo Wio Tracker L1 E-ink
1131/08/2026 previsto
Min: 1
Mult.: 1

NXP Semiconductors Moduli multiprotocollo IW610BHN/A1ZDI
2529/10/2026 previsto
Min: 1
Mult.: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Moduli multiprotocollo IW610CHN/A1ZDI
2529/10/2026 previsto
Min: 1
Mult.: 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors Moduli multiprotocollo IW610FHN/A1ZDI
2529/10/2026 previsto
Min: 1
Mult.: 1
: 2.700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Moduli multiprotocollo IW611HN/A1C
2529/10/2026 previsto
Min: 1
Mult.: 1
: 2.000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Reel, Cut Tape
NXP Semiconductors Moduli multiprotocollo IW612HN/A1I
10029/10/2026 previsto
Min: 1
Mult.: 1
: 2.000

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Reel, Cut Tape
Silicon Labs Moduli multiprotocollo 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
51708/09/2026 previsto
Min: 1
Mult.: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 1.85 V 3.3 V - 40 C + 85 C External 9.8 mm x 9.1 mm x 1.6 mm Bluetooth 5.0 802.11 a/b/g/n Tray
Silicon Labs Moduli multiprotocollo 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
9930/11/2027 previsto
Min: 1
Mult.: 1

2.4 GHz, 5.8 GHz Bluetooth 5.0 802.11 a/b/g/n Tray