congatec Soluzioni integrate

Computer-On-Module - COM COM HPC Size A module with Intel Core i7-1185GRE Processor, quad core with 2.8GHz (up to 4.4GHz), 12MB L2 cache, GT96 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.

Computer-On-Module - COM JUMPtec COMe-mBTi10 E3827 2GB

Schede e kit di sviluppo - x86 EVALUATION CARRIER BRD COM EXP TYPE 10

Computer-On-Module - COM COM-HPC Mini module based on Intel Core i7-1365URE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo 12MB Intel Smart Cache Intel Iris Xe Graphics architecture with 96 EUs 32GB onboard LPDDR5x memor

Computer-On-Module - COM JUMPtec COMe-mEL10 E2 x6212RE 4G/16G

Computer-On-Module - COM Qseven module with Intel Atom x6212RE dual core processor with 1.2GHz core frequency, 1.5MB cache, 4GB 3.200MT/s LPDDR4x onboard memory and 32GB eMMC 5.1 onboard flash. Industrial grade temperature range from -40 C to 85 C.

Computer-On-Module - COM COM Express Mini Type10 module with Intel Atom x5-E3940 quad core processor with 1.6GHz core frequency up to 1.8GHz 2MB L2 cache 4GB 1866MT/s DDR3L onboard memory and 16GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C.

Computer-On-Module - COM SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz +1x ARM Cortex-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C.

Computer-On-Module - COM JUMPtec HSP COMe-cTL6 Cu-core threaded

Computer-On-Module - COM COM Express Type 6 Compact module based on AMD Ryzen Embedded 8645HS with 6 cores 4.3GHz up to 5.0GHz (boost) Integrated XDNA NPU Integrated RDNA 3 Graphics 22MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial temp

Computer-On-Module - COM JUMPtec SMARC-sAMX6i 4x0.8 1/4GB

Prese e adattatori USB 2.0 to Serial Adapter DSUB9 based on FTDI FT232