Ruggedized Optical Backplane Interconnect System

TE Connectivity's (TE) Ruggedized Optical Backplane Interconnect System provides a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The system meets VITA 66.1 and 66.4 standards with full-size or half-size modules. The VITA 66.1 modules are full width and accommodate two MT ferrules, while the VITA 66.4 modules are half width and hold a single MT ferrule. Two modules can be fit into the same space as a VITA 66.1 module. The plug (daughtercard) connector housing utilizes a slot feature to facilitate cleaning the MT interfaces, and locating post features help ensure a proper position on the backplane and daughtercard.