Computer-On-Module - COM JUMPtec COMe-cVR6 V1202B

Dissipatori per CPU e chip Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.

Dissipatori Standard passive cooling for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded

Dissipatori per CPU e chip Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole

Dissipatori Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* With bore hole 2.7mm stand-offs.

Dissipatori Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.

Cavi da computer RS232 console adaptor cable

Computer-On-Module - COM JUMPtec COMe Mount Kit 5mm 1set

Computer-On-Module - COM COM Express Type 7 Basic module based on Intel Atom C3308 2-core processor with 1.6 GHz, 4MB Cache and dual channel DDR4 2133 MT/s memory interface for up to 64 GByte (formerly Denverton). Features four 2.5GbE KX interface ports. Commercial tempera

Computer-On-Module - COM COM Express Type 6 Basic module with Skylake-H Intel Core i3-6100E quad core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface.

Dissipatori per CPU e chip Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.

Dissipatori per CPU e chip Standard active cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.