Infineon Technologies Microfoni MEMS XENSIV™
I microfoni MEMS XENSIV™ di Infineon sono progettati per applicazioni che richiedono rumore intrinseco basso (SNR elevato), ampia gamma dinamica, distorsioni sotto all'1% a 128dBSPL e un punto di sovraccarico acustico elevato. I microfoni hanno un rapporto segnale-rumore (SNR) di 70 dB. I microfoni MEMS XENSIV™ offrono segnali audio cristallini, distanza di pick-up estesa e sensibilità ai segnali sia deboli che forti nelle applicazioni.
I microfoni sono dotati di tecnologia Dual Backplate MEMS, basata su un design del microfono simmetrico miniaturizzato, come nei microfoni del condensatore di studio. Ciò si traduce nella linearità del segnale di uscita entro un intervallo dinamico di 95 dB per l'IM69D120 e di 105 dB per l'IM69D130. A ciò si aggiungano un livello di distorsione eccezionalmente basso del 10% con un livello di pressione sonora (SPL) di 135 dB.
Caratteristiche
- Intervallo dinamico di 105 dB
- Rapporto segnale/rumore di 69 dB (A) - SNR
- Distorsioni armoniche totali <1% fino a 128 dB-SPL
- Punto di sovraccarico acustico a 130 dB-SPL
- Sensibilità (± 1 dB) e fase (± 2° a 1kHz)
- Risposta in frequenza piatta con roll-off a bassa frequenza di 28 Hz
- Velocità di conversione da analogico a digitale molto rapida (latenza di 6 μs a 1 kHz)
- Modalità di alimentazione ottimizzata determinata dalla frequenza di clock PDM
- Dimensioni pacchetto: 4 mm x 3 mm x 1,2 mm
- Uscita PDM
- Pickup pattern omnidirezionale
Applicazioni
- Dispositivi con interfaccia utente vocale (VUI)
- Altoparlanti smart
- Automazione domestica
- Dispositivi IOT
- Cuffie e auricolari con cancellazione attiva del rumore (ANC)
- Acquisizione audio di alta qualità
- Sistemi per conferenze
- Videocamere e camcorder
- Monitoraggio industriali o domestico con rilevamento schema audio
IM69D128S
Great signal-to-noise ratio (SNR) of 69dB(A) enables a crystal clear audio experience without compromising on battery life. Enabled by a revolutionary digital microphone ASIC, the IM69D128S sets a benchmark by cutting current consumption to 520μA – almost half of what models with similar performance on the market can offer. Additionally, IM69D128S masters the art of switching between different power and performance profiles without any audible artifacts, i.e., glitches that the user can hear.
IM70D122
High performance digital XENSIV MEMS microphone IM70D122 makes the most out of Infineon´s Sealed Dual Membrane technology to meet a very high signal-to-noise ratio of 70dB(A) and a very high sensitivity of -26dBFS. Especially thanks to its high sensitivity and high SNR, the IM70D122 is perfectly tailored for advanced audio capturing, which can uplift the audio experience for laptops, tablets, cameras, and conference systems.
IM73D122
Ultra-low noise digital XENSIV MEMS microphone IM73D122 is designed for applications that require a very high SNR (low self-noise) and high sensitivity. The flat frequency response (20Hz low-frequency roll-off) and tight manufacturing tolerance improve the performance of multi-microphone (array) applications. This microphone is based on Infineon's Sealed Dual Membrane MEMS technology, which delivers high ingress protection (IP57) at a microphone level.
IM68A130
The IM68A130 is a high-performance, single-ended, analog MEMS microphone designed for applications that require a low LFRO (10Hz), a high SNR (low self-noise), and low distortion (high AOP). The high signal-to-noise ratio (SNR) of 68dB(A) enables far-field and low-volume audio pick-up. The flat frequency response and tight manufacturing tolerance improve the performance of Active Noise Cancellation (ANC) and multi-microphone array applications.
IM70A135
Infineon’s XENSIV MEMS analog microphone IM70A135 is a compact, high-performance microphone with a very high acoustic overload point of 135dBSPL and a size of only 3.50mm x 2.65mm x 1.00mm3. This microphone is based on Infineon’s Sealed Dual Membrane MEMS technology, which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.
IM72D128V01
The IM72D128V01 is an ultra-high-performance digital microphone designed for applications that require a very high SNR (low self-noise) and low distortions (high AOP). This microphone is based on Infineon's Sealed Dual Membrane MEMS technology, which delivers high ingress protection (IP57) at a microphone level. The flat frequency response (20Hz low-frequency roll-off) and tight manufacturing tolerance improve the performance of multi-microphone (array) applications. Different power modes can be selected to suit specific clock frequencies and current consumption requirements.
IM69D127
IM69D127 is a digital high-performance MEMS microphone based on Infineon's Sealed Dual Membrane MEMS technology, which delivers high ingress protection (IP57) at a microphone level. Its small size of only 3.60mm x 2.50mm x 1.00mm3 makes it a perfect match for compact audio devices, like TWS earbuds.
IM73A135
Infineon’s XENSIV MEMS analog microphone IM73A135 features a signal-to-noise ratio (SNR) of 73dB and a high acoustic overload point of 135dBSPL to enable clear audio pick-up of the quietest and the loudest sounds. The IM73A135 allows designers to reach a level of high audio performance that was previously only achievable by ECMs while at the same time reaping the benefits inherent in MEMS technology.
IM69D129F
The IM69D129F low-power digital XENSIV™ MEMS microphone is designed for applications that require a digital PDM MEMS microphone with very low current consumption, high Signal-to-Noise Ratio (low self-noise), and low distortion (high AOP). This microphone features an omnidirectional pickup pattern, an acoustic overload point at 129dBSPL, and 450μA current consumption. Typical applications include laptops, tablets, IoT devices, cameras, and home automation.
AUDIOHUB NANO
The Infineon Audiohub Nano Digital EVALAHNBDIGITALV01TOBO1 board enables the evaluation of Infineon analog XENSIV MEMS microphones. The kit includes an Infineon Audiohub Nano and four analog microphones on a flex board. Up to two Infineon analog XENSIV MEMS microphones can be connected to the mono or stereo output evaluation board. The evaluation board provides a USB audio interface to stream audio data from the microphone with any audio recording and editing software.
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