Ezurio Sona™ NX611 Wi-Fi 6 + BLUETOOTH® 5.4 Modules

Ezurio Sona™ NX611 Wi-Fi® 6 + BLUETOOTH® 5.4 Modules are highly integrated 2.4/5GHz dual-band 1x1 Wi-Fi 6, Bluetooth/Bluetooth Low Energy 5.4 single-chip solutions optimized for a broad array of IoT and industrial applications. The pre-calibrated devices integrate the complete transmit/receive RF paths, including diplexer, low noise amplifiers (LNAs), RF switches, reference crystal oscillators, and power management units (PMU). Ezurio Sona NX611 modules include a full-feature Wi-Fi subsystem powered by NXP’s 802.11ax (Wi-Fi 6) technology, bringing higher throughput, better network efficiency, lower latency, and improved range over previous generation Wi-Fi standards. The Wi-Fi subsystem integrates a Wi-Fi MAC, baseband, and direct-conversion radio with integrated PA, LNA, and transmit/receive switch, removing the need for an RF front-end module (FEM), saving cost, and reducing system complexity. The modules include various form factors, integration levels, and RF paths to accommodate user applications.

Features

  • Tested with the NXP family of processors and Ezurio's (formerly Laird Connectivity) Linux backports
  • Integrated PA (power amplifier) and LNA (low noise amplifier) with 1x1 antenna for reliable connectivity in harsh RF environments
  • Rich feature set including 802.11ax Wi-Fi 6 and Dual-Mode Bluetooth v5.4
  • Industrial operating temperature range and options for solder-down modules are suitable for industrial rugged applications
  • Supports WPA2/WPA3 Enterprise security standards

Applications

  • Medical
  • Industrial
  • IoT sensors
  • Consumer
  • Handheld mobility

Specifications

  • Wi-Fi
    • IEEE 802.11a/b/g/n/ac/ax, 1x1 SISO 2.4GHz and 5GHz, up to 80MHz channel bandwidth
    • Up to 480Mbps peak data rates
    • Integrated high-power PA up to +21dBm transmit power
    • Integrated LNA and T/R switches
    • UL/DL OFDMA
    • 802.11ax TWT (station only)
    • 802.11ax ER, DCM
    • WPA2 and WPA3 personal and enterprise security
    • Support for Matter over Wi-Fi
  • Bluetooth
    • Supports Bluetooth 5.2 (Class 1/Class 2) and Bluetooth Low Energy features
    • Bluetooth 5.4 certified
    • Integrated high-power PA up to +19dBm transmit power for Bluetooth LE and BDR1, 2, and 3
    • Integrated high-power PA up to +10dBm transmit power for EDR
    • BDR/EDR packet types
      • 1Mbps (GFSK)
      • 2Mbps (/4-DQPSK)
      • 3Mbps (8DPSK)
    • Bluetooth LE long-range (125/500kbps) support
    • Bluetooth LE 2Mbps
    • Bluetooth LE advertising extensions for improved capacity
    • Isochronous channels (ISOC) supporting LE Audio and Auracast™ Broadcast Audio
  • NXP IW611 wireless chipset
  • 2.4GHz and 5GHz frequencies
  • Supply voltages
    • 3.3V and 1.8V for the SIP 76-pin LGA
    • 3.3V for the 1216 96-pin LGA
    • 3.3V for the 2230 75-pin PCIe M.2
  • Simultaneous Wi-Fi/Bluetooth receive with single and dual antenna/RF pad configurations supported
  • Coexistence
    • Internal coexistence between Wi-Fi and Bluetooth
    • External coexistence interface for connection to external radios such as LTE
  • Power management
    • Efficient power management system
    • Deep-sleep low-power mode
    • Integrated high-efficiency buck DC-DC converter
    • Wake-up through GPIO, host interface, and RTC
  • One Time Programmable (OTP) memory to store the MAC address and calibration data
  • Security
    • Hardware root of trust
    • Authenticated and secured boot
    • OTP-based life-cycle state support
  • Package options
    • SIP 76-pin LGA, 11mm x 11mm
    • 1216 96-pin LGA, 12mm x 16mm
    • 2230 75-pin PCIe M.2, 22mm x 30mm
  • -40°C to +85°C operating temperature range

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Pubblicato: 2024-07-15 | Aggiornato: 2025-07-30