SMD/SMT Moduli multiprotocollo

Risultati: 350
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Serie Frequenza Potenza di uscita Tipo di interfaccia Tensione di alimentazione - Min. Tensione di alimentazione - Max. Temperatura di lavoro minima Temperatura di lavoro massima Tipo connettore antenna Dimensioni Protocollo - Bluetooth, BLE - 802.15.1 Protocollo - cellulare, Nbiot, LTE Protocollo - GPS, GLONASS Protocollo - Sub Ghz Protocollo - Wi-Fi - 802.11 Protocollo - ANT, Thread, Zigbee - 802.15.4 Confezione
Nordic Semiconductor Moduli multiprotocollo Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
2.50025/12/2026 previsto
Min: 1
Mult.: 1
: 2.500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape
CEL Moduli multiprotocollo ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3A magazzino
Min: 1
Mult.: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Ezurio Moduli multiprotocollo BL651 Series - Bluetooth v5 Module, Int. Antenna (Nordic nRF52810) Tape & Reel
1.99825/08/2026 previsto
Min: 1
Mult.: 1
: 1.000

BL651 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.7 V 3.6 V - 40 C + 85 C PCB 14 mm x 10 mm x 2.1 mm Bluetooth LE Reel, Cut Tape, MouseReel
Ezurio Moduli multiprotocollo BL5340PA Series Multi-Core / Protocol (Nordic nRF5340) Integrated antenna (Cut Tape)
24811/09/2026 previsto
Min: 1
Mult.: 1

BL5340PA 2.402 GHz to 2.48 GHz I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C MHF4 21 mm x 10 mm x 2.55 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio Moduli multiprotocollo Sterling LWB+, MHF4, Tape and Reel
1.50002/10/2026 previsto
Min: 1
Mult.: 1
: 800

Sterling-LWB+ 2.4 GHz SDIO, UART 3.3 V 3.3 V - 40 C + 85 C 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Reel, Cut Tape
Ezurio Moduli multiprotocollo Module, BL54L15, Bluetooth LE, Chip Antenna, Cut Tape
1.54402/12/2026 previsto
Min: 1
Mult.: 1

BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio Moduli multiprotocollo Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
1.00031/12/2026 previsto
Min: 1
Mult.: 1
: 1.000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Kaga FEI Moduli multiprotocollo WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
30017/11/2026 previsto
Min: 1
Mult.: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Kaga FEI Moduli multiprotocollo WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
30017/11/2026 previsto
Min: 1
Mult.: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
GigaDevice Moduli multiprotocollo RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
80020/11/2026 previsto
Min: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
GigaDevice Moduli multiprotocollo RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
80001/01/2027 previsto
Min: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice Moduli multiprotocollo RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
80001/01/2027 previsto
Min: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
u-blox Moduli multiprotocollo RW612, 802.11ax+BLE+802.15.4, ant pin, open CPU, 16MB
49518/01/2027 previsto
Min: 1
Mult.: 1
: 250

2.4 GHz, 5 GHz 11 dBm 3.15 V 3.45 V - 40 C + 85 C Antenna Pin Bluetooth LE/IEEE 802.15.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
u-blox Moduli multiprotocollo Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
25012/10/2026 previsto
Min: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Moduli multiprotocollo Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
75031/12/2026 previsto
Min: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Moduli multiprotocollo IW612, 802.11ax+BT+802.15.4, 1 PCB antenna or ant. pin
958In ordine
Min: 1
Mult.: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape, MouseReel
u-blox Moduli multiprotocollo Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
50031/12/2026 previsto
Min: 1
Mult.: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Texas Instruments Moduli multiprotocollo SimpleLink multipro tocol 2.4-GHz wirele
1.90001/10/2026 previsto
Min: 1
Mult.: 1
: 2.000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Texas Instruments Moduli multiprotocollo SimpleLink multipro tocol 2.4-GHz wirele
1.96803/09/2026 previsto
Min: 1
Mult.: 1
: 2.000

CC2652RSIP 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External 7 mm x 7 mm BLE ISM Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
99804/01/2027 previsto
Min: 1
Mult.: 1
: 1.000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1.00023/10/2026 previsto
Min: 1
Mult.: 1
: 1.000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1.07026/08/2026 previsto
Min: 1
Mult.: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
2.86001/09/2026 previsto
Min: 1
Mult.: 1
: 1.000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Moduli multiprotocollo SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
200In ordine
Min: 1
Mult.: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
NXP Semiconductors Moduli multiprotocollo IW610BHN/A1ZDI
2529/10/2026 previsto
Min: 1
Mult.: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray