Dual Cool™ MOSFETs

onsemi Dual Cool™ PowerTrench® MOSFETs provide Dual Cool packaging technology that features bottom- and top-side cooling in a PQFN package. The PQFN footprint is an industry standard and provides performance flexibility for the designer. The Dual Cool MOSFETs feature enhanced dual path thermal performance and improved parasitics over wire-bonded predecessors. The use of a heat sink with Dual Cool packaging technology provides even more impressive results. When a heat sink is used with onsemi Dual Cool package technology, synchronous buck converters deliver higher output current and increased power density.