Moduli multiprotocollo

Risultati: 246
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Serie Frequenza Potenza di uscita Tipo di interfaccia Tensione di alimentazione - Min. Tensione di alimentazione - Max. Temperatura di lavoro minima Temperatura di lavoro massima Tipo connettore antenna Dimensioni Protocollo - Bluetooth, BLE - 802.15.1 Protocollo - cellulare, Nbiot, LTE Protocollo - GPS, GLONASS Protocollo - Sub Ghz Protocollo - Wi-Fi - 802.11 Protocollo - ANT, Thread, Zigbee - 802.15.4 Confezione
Ezurio Moduli multiprotocollo 60 Series, Sterling Module w/u.FL, USB/UART Tempo di consegna, se non a magazzino 26 settimane
Min: 1
Mult.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Espressif Systems Moduli multiprotocollo SMD module, ESP32-U4WDH with 4 MB flash die inside, ESP32 ECO V3, IPEX connector 1.036A magazzino
Min: 1
Mult.: 1
2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm Bluetooth 4.2 Tray
Espressif Systems Moduli multiprotocollo SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 4 MB SPI flash, PCB antenna 2.482A magazzino
1.95021/07/2026 previsto
Min: 1
Mult.: 1

2.4 GHz 20.5 dBm I2C, I2S, SPI, PWM, UART, USB 3 V 3.6 V - 40 C + 85 C PCB 25.5 mm x 18 mm x 3.1 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Moduli multiprotocollo SMD module, ESP32-S3R8 with 8 MB Octal PSRAM die inside, 4 MB Quad SPI flash, PCB antenna 3.674A magazzino
1.95021/07/2026 previsto
Min: 1
Mult.: 1

2.4 GHz 20.5 dBm I2C, I2S, SPI, PWM, UART, USB 3 V 3.6 V - 40 C + 65 C PCB 25.5 mm x 18 mm x 3.1 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Moduli multiprotocollo SMD module, ESP32-S3, 16 MB SPI flash, IPEX antenna connector 556A magazzino
4.55020/11/2026 previsto
Min: 1
Mult.: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Moduli multiprotocollo SMD module, ESP32-S3, 16 MB SPI flash, PCB antenna 661A magazzino
6.50030/07/2026 previsto
Min: 1
Mult.: 1

2.4 GHz 20.5 dBm I2C, I2S, SPI, PWM, UART, USB 3 V 3.6 V - 40 C + 85 C PCB 25.5 mm x 18 mm x 3.1 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Moduli multiprotocollo SMD module, ESP32-S3, 4 MB SPI flash, IPEX antenna connector 733A magazzino
5.20021/07/2026 previsto
Min: 1
Mult.: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Moduli multiprotocollo SMD Module ESP32-WROVER-IE, ESP32-D0WD-V3, 3.3V 64Mbit PSRAM, 4 MB SPI flash, IPEX connector 9.935A magazzino
Min: 1
Mult.: 1

ESP32-WROVER 2.4 GHz 20 dBm I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C IPEX 18 mm x 31.4 mm x 3.3 mm BLE, Bluetooth 4.2 BR/EDR 802.11 b/g/n Tray
Microchip Technology Moduli multiprotocollo ATWILC3000 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 179A magazzino
36003/08/2026 previsto
Min: 1
Mult.: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C u.FL 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology Moduli multiprotocollo b/g/n + Bluetooth 4 Module U.FL Antenna 46A magazzino
Min: 1
Mult.: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Espressif Systems Moduli multiprotocollo SMD module, ESP32-S3R8 with 8 MB Octal PSRAM die inside, 4 MB Quad SPI flash, IPEX antenna connector 209A magazzino
6.50020/08/2026 previsto
Min: 1
Mult.: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 65 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
DFRobot Moduli multiprotocollo Gravity: CAT1 SIM7600G Global 4G Communication and GNSS Positioning Module (10Mbps/5Mbps)
1A magazzino
Min: 1
Mult.: 1

1.9 GHz 5 V 12 V - 40 C + 85 C 60 mm x 52 mm GPS, BD, GLONASS Bulk
Embedded Artists Moduli multiprotocollo 1ZM M.2 Wi-Fi 5 a/b/g/n/ac, Bluetooth 5.1 with 88W8987 chipset and LBEE5QD1ZM 14A magazzino
Min: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.1 802.11 a/b/g/n/ac Bulk
Embedded Artists Moduli multiprotocollo 2AE M.2 Wi-Fi 5 a/b/g/n/ac, Bluetooth 5.2 with CYW4373E chipset and LBEE5PK2AE 26A magazzino
3330/10/2026 previsto
Min: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.5 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Ezurio Moduli multiprotocollo 60 Series, Sterling Module w/u.FL, USB/USB 2A magazzino
500In ordine
Min: 1
Mult.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray


Espressif Systems Moduli multiprotocollo Espressifs AWS IoT ExpressLink Module, pre-provisioned with required certificates and the ExpressLink firmware, for out-of-the-box connectivity to AWS IoT Core. 132A magazzino
1.30027/07/2026 previsto
Min: 1
Mult.: 1
2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth Bulk
Microchip Technology Moduli multiprotocollo Wi-Fi + Bluetooth LE Module,u.FL Antenna 26A magazzino
Min: 1
Mult.: 1

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology Moduli multiprotocollo ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 22A magazzino
Min: 1
Mult.: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray

Silicon Labs Moduli multiprotocollo Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), MVP, 78 MHz, 10 dBm 9A magazzino
Min: 1
Mult.: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Embedded Artists Moduli multiprotocollo 1XK M.2 Wi-Fi 4 a/b/g/n, Bluetooth 5.2 with IW416 chipset and LBEE5CJ1XK module 2A magazzino
4In ordine
Min: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.5 V - 40 C + 85 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 b/g/n Bulk
Silicon Labs Moduli multiprotocollo 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules 54A magazzino
Min: 1
Mult.: 1

2.4 GHz, 5.8 GHz Bluetooth 5.0 802.11 a/b/g/n Tray
Silex Technology Moduli multiprotocollo [Bulk SKU] SX-PCEAX-HMC is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in a half-height Mini PCIe Card form factor. It is based on Qualcomm's QCA2066 chipset. 503A magazzino
Min: 1
Mult.: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe 3.3 V 3.3 V - 20 C + 65 C 29.85 mm x 26.65 mm x 2.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Tray
Ezurio Moduli multiprotocollo SDIO 802.11a/b/g/n M2 Module and Bluetooth 4.0 UART 8A magazzino
Min: 1
Mult.: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART 3.2 V 3.46 V - 30 C + 85 C RF 22 mm x 30 mm x 3.3 mm Bluetooth 4.0 802.11 a/b/g/n Tray
CEL Moduli multiprotocollo WiFi+BLE, USB, Conn. 105A magazzino
Min: 1
Mult.: 1

CMP9377 2.4 GHz, 5 GHz 20 dBm USB 3.3 V 3.3 V - 40 C + 85 C External 17 mm x 12 mm x 3 mm Bluetooth 5.0 802.11 a/b/g/n/ac Tray
Quectel Moduli multiprotocollo Cat 4, 4Gbit ROM+2Gbit RAM, LTE only, Data only application, North America, mPCIe form factor
92A magazzino
Min: 1
Mult.: 1

700 MHz to 960 MHz, 1.71 GHz to 2.69 GHz, 3.3 GHz to 5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray