+ 125 C Moduli multiprotocollo

Risultati: 38
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Serie Frequenza Potenza di uscita Tipo di interfaccia Tensione di alimentazione - Min. Tensione di alimentazione - Max. Temperatura di lavoro minima Temperatura di lavoro massima Tipo connettore antenna Dimensioni Protocollo - Bluetooth, BLE - 802.15.1 Protocollo - Wi-Fi - 802.11 Protocollo - ANT, Thread, Zigbee - 802.15.4 Confezione
Silicon Labs Moduli multiprotocollo MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 1.490A magazzino
6.00025/12/2026 previsto
Min: 1
Mult.: 1
: 1.000

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Moduli multiprotocollo MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 380A magazzino
Min: 1
Mult.: 1
: 1.000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Telink Moduli multiprotocollo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 2A magazzino
Min: 1
Mult.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
NXP Semiconductors Moduli multiprotocollo IW610BUK/A1ZDI 25A magazzino
Min: 1
Mult.: 1
: 2.000

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
Silicon Labs Moduli multiprotocollo Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified. 200A magazzino
Min: 1
Mult.: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 125 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
NXP Semiconductors Moduli multiprotocollo IW610GHN/A1ZDI 1.240A magazzino
Min: 1
Mult.: 1

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 223A magazzino
Min: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs Moduli multiprotocollo Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified. 3.752A magazzino
Min: 1
Mult.: 1
: 1.000

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape


Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 72A magazzino
Min: 1
Mult.: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 177A magazzino
Min: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 174A magazzino
Min: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 153A magazzino
Min: 1
Mult.: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs Moduli multiprotocollo 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 149A magazzino
Min: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs Moduli multiprotocollo Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified. 1.390A magazzino
1.00028/09/2026 previsto
Min: 1
Mult.: 1
: 1.000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Moduli multiprotocollo Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified. 745A magazzino
50028/09/2026 previsto
Min: 1
Mult.: 1

MGM210P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Murata Electronics Moduli multiprotocollo Shielded Small Wi-Fi 11a/b/g/n/ac/ax 2x2 MIMO + Bluetooth 5.3 Module
556A magazzino
Min: 1
Mult.: 1
: 1.000

2XS 2.4 GHz, 5 GHz 18 dBm PCIe, SDIO, UAR 1.71 V 3.46 V - 40 C + 125 C 19.2 mm x 16.5 mm x 2.1 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
Silicon Labs Moduli multiprotocollo Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified. 8A magazzino
Min: 1
Mult.: 1

MGM210P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Moduli multiprotocollo MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 37A magazzino
Min: 1
Mult.: 1

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Microchip Technology Moduli multiprotocollo Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
14424/09/2026 previsto
Min: 1
Mult.: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
NXP Semiconductors Moduli multiprotocollo IW610BHN/A1ZDI
2521/08/2026 previsto
Min: 1
Mult.: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Moduli multiprotocollo IW610CHN/A1ZDI
2521/08/2026 previsto
Min: 1
Mult.: 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors Moduli multiprotocollo IW610CUK/A1ZDI
2521/08/2026 previsto
Min: 1
Mult.: 1
: 2.000

IW610CUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors Moduli multiprotocollo IW610FHN/A1ZDI
2521/08/2026 previsto
Min: 1
Mult.: 1
: 2.700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Moduli multiprotocollo IW610FUK/A1ZDI
2521/08/2026 previsto
Min: 1
Mult.: 1
: 2.000

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Moduli multiprotocollo IW610GUK/A1ZDI
2521/08/2026 previsto
Min: 1
Mult.: 1
: 2.000

IW610GUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape