Wireless Ecosystem

Wireless technologies like Wi-Fi® for wireless local area networks (WLAN), BLUETOOTH® technology for content streaming, and Bluetooth low energy technology for ultra-low-power connectivity form the backbone of IoT. Infineon Technologies seamlessly integrates all these technologies to provide state-of-the-art, interoperable solutions for consumer, industrial, medical, automotive, and other applications. Infineon’s wireless technology is built from intellectual property (IP) deployed in all mainstream application segments and meets the industry specifications. These technologies can be found in the modules through the various partners below, as well as associated various SOCs. Time to market can be accelerated using one of the many wireless products from Infineon Technologies below.

Risultati: 7
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Serie Frequenza Potenza di uscita Tipo di interfaccia Tensione di alimentazione - Min. Tensione di alimentazione - Max. Temperatura di lavoro minima Temperatura di lavoro massima Tipo connettore antenna Dimensioni Protocollo - Bluetooth, BLE - 802.15.1 Protocollo - Wi-Fi - 802.11 Confezione
Ezurio Moduli multiprotocollo RF Module, Chip Ant Sterling-LWB CYW4343W 913A magazzino
Min: 1
Mult.: 1

Sterling-LWB 2.4 GHz 14 dBm UART 1.8 V 3.6 V - 40 C + 85 C Chip 15.5 mm x 21 mm x 2 mm Bluetooth LE 802.11 b/g/n Cut Tape
Murata Electronics Moduli multiprotocollo Type 1FX Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 8.2
167A magazzino
Min: 1
Mult.: 1
Nastrati: 1.000

1FX 2.4 GHz 17 dBm SDIO 3.35 V 4.2 V - 30 C + 70 C External 6.95 mm x 5.15 mm x 1.1 mm 802.11 b/g/n Reel, Cut Tape
Ezurio Moduli multiprotocollo RF Module, U.FL Sterling-LWB CYW4343W 471A magazzino
Min: 1
Mult.: 1

Sterling-LWB 2.4 GHz 14 dBm UART 1.8 V 3.6 V - 40 C + 85 C u.FL 15.5 mm x 21 mm x 2 mm Bluetooth LE 802.11 b/g/n Cut Tape

Murata Electronics Moduli multiprotocollo Type 1GC Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 9.2
477A magazzino
Min: 1
Mult.: 1
Nastrati: 1.000

1GC 2.4 GHz, 5 GHz 12 dBm Ethernet, GPIO, I2C, SPI, UART, USB 3.13 V 3.63 V - 30 C + 85 C External 10 mm x 10 mm x 1.2 mm 802.11 a/b/g/n Reel, Cut Tape
Murata Electronics Moduli multiprotocollo Type 1DX Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 4.1
13A magazzino
1.00010/06/2026 previsto
Min: 1
Mult.: 1
Nastrati: 1.000

1DX 2.4 GHz 17 dBm SDIO, UART 1.71 V 3.63 V - 30 C + 70 C External 6.95 mm x 5.15 mm x 1.1 mm Bluetooth 4.1 802.11 b/g/n Reel, Cut Tape, MouseReel
Ezurio Moduli multiprotocollo RF Module, Sterling- LWB5, U.FL Tempo di consegna, se non a magazzino 40 settimane
Min: 250
Mult.: 250

Sterling-LWB5 2.4 GHz, 5 GHz 16 dBm GPIO, SDIO/SPI, UART 3.2 V 4.3 V - 40 C + 85 C u.FL 15.5 mm x 21 mm x 2 mm Bluetooth 4.2 802.11 a/b/g/n/ac Cut Tape
Ezurio Moduli multiprotocollo RF Module, Sterling- LWB5, Chip Antenna Tempo di consegna, se non a magazzino 40 settimane
Min: 250
Mult.: 250

Sterling-LWB5 2.4 GHz, 5 GHz 16 dBm GPIO, SDIO/SPI, UART 3.2 V 4.3 V - 40 C + 85 C Chip 15.5 mm x 21 mm x 2 mm Bluetooth 802.11 a/b/g/n/ac Cut Tape