Ka-Ro electronics Computer-On-Module - COM

Risultati: 62
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Fattore di forma Marca del processore Tipo di processore Chipset Frequenza Massima capacità RAM RAM installata Memoria cache Tensione di alimentazione di lavoro Tipo di interfaccia Temperatura di lavoro minima Temperatura di lavoro massima Dimensioni
Ka-Ro electronics Computer-On-Module - COM COM TX8MMQ/1600/1GS/4GF/E85
924A magazzino
Min: 1
Mult.: 1

SO-DIMM NXP i.MX 8M 1.6 GHz 1 GB 0 GB 3.3 V to 5 V - 25 C + 85 C 67.6 mm x 26 mm x 4 mm
Ka-Ro electronics Computer-On-Module - COM QFN type lead style has a 1mm pitch with 100 pads. The ground pad additionally acts as thermal pad.
50A magazzino
Min: 1
Mult.: 1

Renesas RZ/G2L 1.2 GHz 1 GB 3.1 V to 3.6 V - 40 C + 85 C
Ka-Ro electronics Computer-On-Module - COM iMX6 Quad COM SO-DIMM
16A magazzino
Min: 1
Mult.: 1
SO-DIMM Freescale i.MX 6Quad 1 GHz 1 GB 0 GB 1 MB 3.1 V to 5.5 V - 20 C + 70 C 67.6 mm x 31 mm x 3.6 mm
Ka-Ro electronics Computer-On-Module - COM Freescale iMX537 COM SODIMM IND TEMP LVDS
50A magazzino
Min: 1
Mult.: 1

SO-DIMM Freescale i.MX537 800 MHz 512 MB 3.1 V to 5.5 V CAN, I2C, UART - 40 C + 85 C 67.6 mm x 31 mm x 3.6 mm
Ka-Ro electronics Computer-On-Module - COM The QSMP2 is a solderable Sytem on Module with a size of only 29 by 29 mm. 43A magazzino
Min: 1
Mult.: 1

- 40 C + 85 C 33 mm x 33 mm x 5.6 mm
Ka-Ro electronics Computer-On-Module - COM The QSMP-1351 is a QFN Style Solder-Down Computer On Module. The module with a small square size of 27mm and a height of 2.7mm is single-sided assembled. Its QFN type lead style has a 1mm pitch with 100 pads. The ground pad additionally acts as therm 18A magazzino
Min: 1
Mult.: 1

ARM ARM Cortex-A7 650 MHz 256 MB 3.3 V CAN, Ethernet, I2C, SPI, UART, USB - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Module - COM QSMP2/SOCK is a socketed version of the QSMP2 Sytem on Module. QS00-SV05 needed. 10A magazzino
Min: 1
Mult.: 1

- 40 C + 85 C 33 mm x 33 mm x 5.6 mm
Ka-Ro electronics Computer-On-Module - COM QSMP/157C/512S/4GF/E85
257A magazzino
Min: 1
Mult.: 1

NXP STM32MP157C 200 MHz, 650 MHz 512 MB 32 kB, 256 kB Ethernet, FD-CAN, I2C, MIPI-DSI, SAI, SPI, UART, USB - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Module - COM iMX6 Quad COM SO-DIMM Ind Temp
127A magazzino
Min: 1
Mult.: 1

SO-DIMM Freescale i.MX 6Quad 1 GHz 1 GB 0 GB 1 MB 3.1 V to 5.5 V - 20 C + 70 C 67.6 mm x 31 mm x 3.6 mm
Ka-Ro electronics Computer-On-Module - COM The QS93 is a QFN Style Solder-Down Computer On Module.
119A magazzino
Min: 1
Mult.: 1

NXP i.MX 93 1.5 GHz 1 GB 1 GB 3.3 V I2C, SPI, UART, USB - 40 C + 85 C
Ka-Ro electronics Computer-On-Module - COM The TX91 is a plug-in System-on-Module with 200 pins, designed for longevity. 7A magazzino
Min: 1
Mult.: 1

NXP ARM Cortex-A55 i.MX 91 1.4 GHz 3.3 V to 5 V - 25 C + 85 C 67.6 mm x 26 mm x 4 mm
Ka-Ro electronics Computer-On-Module - COM The TX93 is a member of the TX Module family.
9A magazzino
Min: 1
Mult.: 1

NXP i.MX 93 1.5 GHz 1 GB 1 GB 3.3 V to 5 V I2C, SPI, UART, USB - 25 C + 85 C 68 mm x 26 mm x 4 mm
Ka-Ro electronics Computer-On-Module - COM The TXMP2 is a plug-in System-on-Module with 200 pins, designed for longevity. 8A magazzino
Min: 1
Mult.: 1

NXP ARM Cortex-A35 1.5 GHz 5 V - 40 C + 85 C 67.6mm x 26 mm x 4 mm
Ka-Ro electronics Computer-On-Module - COM Karo QSXP-ML81
30A magazzino
Min: 1
Mult.: 1

i.MX 8M 800 MHz 2 GB 3.3 V to 5 V CSI, HDMI, I2C, LAN, MIPI, PCIe, SPI, UART, USB - 30 C + 85 C 29 mm x 29 mm x 2.6 mm
Ka-Ro electronics Computer-On-Module - COM TX6ULL/800/512S/4GF/E85
214A magazzino
Min: 1
Mult.: 1
SO-DIMM NXP i.MX 6ULL MCIMX6Y2 792 MHz 512 MB 0 GB 128 kB 3.1 V to 5.5 V - 25 C + 85 C 68 mm x 26 mm x 4 mm
Ka-Ro electronics Computer-On-Module - COM The QS91 is a solderable Sytem-on-Module with a size of only 27 by 27 mm. 7A magazzino
Min: 1
Mult.: 1

ARM ARM Cortex-A55 32 kB, 32 kB, 256 kB 1.4 GHz 512 MB 3.3 V Ethernet, UART, USB - 25 C + 85 C
Ka-Ro electronics Computer-On-Module - COM QS91/SOCK is a socketed version of the QS91 Sytem-on-Module. QS00-SV04 needed. 7A magazzino
Min: 1
Mult.: 1

NXP ARM Cortex-A55 i.MX 9131 1.4 GHz 512 MB 3.3 V - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Module - COM QS93/SOCK is a socketed version of the QS91 Sytem-on-Module. QS00-SV04 needed. 7A magazzino
Min: 1
Mult.: 1

NXP ARM Cortex-A55, ARM Cortex-M33 i.MX 9352 1.7 GHz 3.3 V - 40 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Module - COM QSMP/151A/256S/128F/I socketed module
6A magazzino
Min: 1
Mult.: 1

STM32MP1 650 MHz, 200 MHz 256 MB 256 MB 32 kB, 256 kB 3.3 V Ethernet, I2C, SAI, SPI, UART, USB - 40 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Module - COM QS8M/MQ/1600/1024S/4GF/E85
73A magazzino
79In ordine
Min: 1
Mult.: 1

NXP i.MX 8M Mini 400 MHz, 1.6 GHz 1 GB 1 GB 32 kB, 512 kB 3.3 V Ethernet, I2C, MIPI CSI, SAI, SPI, UART, USB - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Module - COM Freescale iMX257 COM SO-DIMM IND TEMP
40A magazzino
Min: 1
Mult.: 1

SO-DIMM Freescale i.MX253 400 MHz 64 MB 3.1 V to 5.5 V CAN, I2C, UART, USB - 40 C + 85 C 67.6 mm x 26 mm x 3.6 mm
Ka-Ro electronics Computer-On-Module - COM QS8M Evaluation Kit including QS8M-MQ00
2A magazzino
Min: 1
Mult.: 1

3.3 V Ethernet, I2C, MIPI CSI, SAI, SPI, UART, USB - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Module - COM Freescale iMX6 Solo COM SO-DIMM IND TEMP
2A magazzino
Min: 1
Mult.: 1

SO-DIMM Freescale i.MX 6S7 800 MHz 512 MB 0 GB 1 MB 3.1 V to 5.5 V - 25 C + 85 C 68 mm x 31 mm x 4 mm
Ka-Ro electronics Computer-On-Module - COM iMX6 Ultra Lite COM SO-DIMM
2A magazzino
Min: 1
Mult.: 1

Ka-Ro electronics Computer-On-Module - COM QSMP/153A/256S/4GF/E85
5A magazzino
Min: 1
Mult.: 1

NXP STM32MP153A 200 MHz, 650 MHz 256 MB 256 MB 32 kB, 256 kB Ethernet, FD-CAN, I2C, SAI, SPI, UART, USB - 25 C + 85 C 27 mm x 27 mm x 2.3 mm