Octavo Systems Sistemi su moduli - SOM

Risultati: 19
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Serie Fattore di forma Marca del processore Tipo di processore Frequenza Massima capacità RAM RAM installata Tensione di alimentazione di lavoro Tipo di interfaccia Temperatura di lavoro minima Temperatura di lavoro massima Dimensioni Confezione
Octavo Systems Sistemi su moduli - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - -40 C to 85 C 374A magazzino
Min: 1
Mult.: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 27 mm x 27 mm Tray
Octavo Systems Sistemi su moduli - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - 0 C to 85 C 130A magazzino
Min: 1
Mult.: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 27 mm x 27 mm Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: Texas Instruments AM6254 ARM Quad Cortex A53 Processor, 1GB DDR4, Passives - 9mm X 14mm 500 Ball BGA - -40C to 85C 128A magazzino
Min: 1
Mult.: 1

OSD62x 1.8 V, 3.3 V - 40 C + 85 C Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 100C 10A magazzino
Min: 1
Mult.: 1

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 100 C 20.5 mm X 40 mm Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 1GBB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C 363A magazzino
Min: 1
Mult.: 1

Texas Instruments AM3358 1 GHz 1 GB 1 GB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 27 mm x 27 mm Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C 81A magazzino
16815/05/2026 previsto
Min: 1
Mult.: 1
OSD32MP15x STMicroelectronics STM32MP157C 209 MHz, 650 MHz 1 GB 512 MB 2.8 V to 5.5 V Camera, CAN, I2C, SAI, SDIO, SPI, UART, USB 0 C + 85 C 18 mm x 18 mm Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C 236A magazzino
Min: 1
Mult.: 1
OSD32MP15x STMicroelectronics STM32MP157C 209 MHz, 650 MHz 1 GB 512 MB 2.8 V to 5.5 V Camera, CAN, I2C, SAI, SDIO, SPI, UART, USB - 40 C + 85 C 18 mm x 18 mm Tray
Octavo Systems Sistemi su moduli - SOM AM3358 512MB DDR3 System-In-Package
420In ordine
Min: 1
Mult.: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 21 mm x 21 mm Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C
1.500In ordine
Min: 1
Mult.: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 21 mm x 21 mm Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 0C to 85C
620/02/2026 previsto
Min: 1
Mult.: 1

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C 20.5 mm X 40 mm Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C
316/02/2026 previsto
Min: 1
Mult.: 1

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 20.5 mm X 40 mm Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C
320/04/2026 previsto
Min: 1
Mult.: 1

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 20.5 mm X 40 mm Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 20 C to 85 C Tempo di consegna, se non a magazzino 18 settimane
Min: 1
Mult.: 1

STMicroelectronics STM32MP157F 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C Tempo di consegna, se non a magazzino 18 settimane
Min: 1
Mult.: 1

STMicroelectronics STM32MP153C 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: ST Micro STM32MP153C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C Tempo di consegna, se non a magazzino 18 settimane
Min: 1
Mult.: 1

STMicroelectronics STM32MP153C 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: ST Micro STM32MP157F Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C Tempo di consegna, se non a magazzino 18 settimane
Min: 84
Mult.: 84

STMicroelectronics STM32MP157F 209 MHz, 800 MHz 384 kB 2.8 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 0C to 85C Tempo di consegna, se non a magazzino 20 settimane
Min: 6
Mult.: 6

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB 0 C + 85 C 20.5 mm X 40 mm Tray
Octavo Systems Sistemi su moduli - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 100C Tempo di consegna, se non a magazzino 20 settimane
Min: 1
Mult.: 1

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 100 C 20.5 mm X 40 mm Tray
Octavo Systems Sistemi su moduli - SOM AM3358 512MB DDR3 System-In-Package
Tempo di consegna, se non a magazzino 28 settimane

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 27 mm x 27 mm Tray