146175-0001

Molex
538-146175-0001
146175-0001

Produttore:

Descrizione:
Antenne 2.4/5GHz SMTOnGround MID Chip Antenna

Modello ECAD:
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A magazzino: 3.927

A magazzino:
3.927 Spedizione immediata
Tempo di consegna da parte della fabbrica:
15 settimane Tempo di produzione stimato in fabbrica per quantità superiori a quelle indicate.
Minimo: 1   Multipli: 1
Prezzo Unitario:
-,-- €
Prezzo esteso:
-,-- €
Stima Tariffa:
Confezione:
Nastrati completa (ordinare in multipli di 1650)

Prezzi (EUR)

Qtà Prezzo Unitario
Prezzo esteso
Nastro tagliato / MouseReel™
0,714 € 0,71 €
0,597 € 5,97 €
Nastrati completa (ordinare in multipli di 1650)
0,597 € 985,05 €
† La commissione 5,00 € MouseReel™ verrà aggiunta e calcolata nel carrello. Nessuno degli ordini di articoli MouseReel™ può essere annullato o reso.

Attributo del prodotto Valore dell'attributo Seleziona attributo
Molex
Categoria prodotto: Antenne
RoHS::  
2.4GHz Antenna - 2.4GHz, 5GHz, Bluetooth, WiFi, WLAN, Zigbee
PCB Antennas
Passive Antenna
2.4 GHz
5.85 GHz
Bluetooth, BLE
802.15.4 (ANT, Thread, Zigbee), 802.16
IoT, ISM, U-NII
Chip
Chip
3 dB, 4.2 dB
50 Ohms
2 W
- 40 C
+ 125 C
2 Band
PCB Mount
SMD/SMT
2.45 GHz, 5.5 GHz
5 mm
3.07 mm
146175
Reel
Cut Tape
MouseReel
Marchio: Molex
Da utilizzarsi con: WiFi
Polarizzazione: Linear
Quantità colli di fabbrica: 1650
Sottocategoria: Antennas
Alias n. parte: 1461750001 01461750001
Peso unità: 280 mg
Prodotti trovati:
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Attributi selezionati: 0

TARIC:
8517700000
CNHTS:
8517710000
CAHTS:
8517710000
USHTS:
8517710000
ECCN:
EAR99

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2.4GHz / 5GHz MID Chip Antenna

Molex 146175 series Molded Interconnect Device (MID) Chip Antenna requires no ground-place clearance and features a frequency of 2.4GHz / 5GHz. This Wi-Fi®-ready Molex MID chip antenna enables wireless device makers to achieve cost-effective designs with higher levels of product integration and fewer components. The gold over nickel traces on the Molex 146175 MID antenna act as transducers that convert unguided electromagnetic waves to guided electromagnetic waves and vice versa. The Laser Direct Structuring (LDS) formed circuitry yields high, consistent RF performance. And the MID housing withstands high reflow temperatures during assembly processing.

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