TS391 No-Clean Solder Paste

Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.

Risultati: 15
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Qtà RoHS Prodotto
Tipo
Lega
Tipo di package
Chip Quik Saldatura Paste No-Clean 15g Sn63/Pb37 T4
Scheda dati
194A magazzino
62013/04/2026 previsto
Min: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Saldatura Paste No-Clean 250g Sn63/Pb37 T4
Scheda dati
35A magazzino
6920/04/2026 previsto
Min: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Saldatura Paste No-Clean 50g Sn63/Pb37 T4
Scheda dati
212A magazzino
36320/04/2026 previsto
Min: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Saldatura Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4
Scheda dati
159A magazzino
21321/04/2026 previsto
Min: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Saldatura Paste NoClean 250g Sn42/Bi57.6/Ag0.4 T4
Scheda dati
24A magazzino
4320/04/2026 previsto
Min: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Saldatura Paste No-Clean 50g Sn42/Bi57.6/Ag0.4 T4
Scheda dati
116A magazzino
Min: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Saldatura Paste NoClean 15g T4 Sn96.5/Ag3.0/Cu0.5
Scheda dati
135A magazzino
Min: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Saldatura Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5
Scheda dati
106A magazzino
20313/04/2026 previsto
Min: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Saldatura Paste NoClean 50g T4 Sn96.5/Ag3.0/Cu0.5
Scheda dati
184A magazzino
Min: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Saldatura Paste No-Clean 35g Sn63/Pb37 T4
Scheda dati
49A magazzino
22113/04/2026 previsto
Min: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Saldatura Paste No-Clean 500g Sn63/Pb37 T4
Scheda dati
6A magazzino
Min: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Cartridge
Chip Quik Saldatura Paste NoClean 35g Sn42/Bi57.6/Ag0.4 T4
Scheda dati
32A magazzino
9513/04/2026 previsto
Min: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Saldatura Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5
Scheda dati
46A magazzino
10413/04/2026 previsto
Min: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Saldatura Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4
Scheda dati
Tempo di consegna, se non a magazzino 6 settimane
Min: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Cartridge
Chip Quik Saldatura Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5
Scheda dati
N/A
Min: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Cartridge