Serial MCP Flash Portfolio with SpiStack®

Winbond Serial MCP Flash Portfolio with SpiStack® is based on the W25Q/W25N SpiFlash® series by stacking W25Q16JV and W25N01GV. The portfolio offers flexible memory density and reliability combinations for the low pin count package and Concurrent Operations in Serial Flash memory for the first time. Winbond W25M SpiStack series is ideal for small form factor system designs and applications that demand high Program/Erase data throughput. The series comprises a 1.8V NAND Flash Memory device and a 1.8V Low Power SDRAM device. MCP is an all-in-one package that provides an effective solution for saving Printed Circuit Board (PCB) space. This benefit becomes more critical in small PCBs for modules and space-critical designs, particularly for mobile and portable applications.

Risultati: 3
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Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità.
Qtà RoHS Modello ECAD Tipo
Dimensioni memoria
Package/involucro
Serie
Stile di montaggio
Frequenza di clock massima
Temperatura di lavoro minima
Temperatura di lavoro massima
Winbond Pacchetti multichip spiFlash, 512M-bit, 4Kb Uniform Sector
Scheda dati
180A magazzino
Min: 1
Mult.: 1
Max.: 180

Serial NOR Flash 512 Mbit TFBGA-24 W25M512JV SMD/SMT 104 MHz - 40 C + 85 C
Winbond Pacchetti multichip spiFlash, 512M-bit, 4Kb Uniform Sector
Scheda dati
5A magazzino
Min: 1
Mult.: 1
Max.: 5

Serial NOR Flash 512 Mbit WSON-8 W25M512JV SMD/SMT 104 MHz - 40 C + 85 C

Winbond Pacchetti multichip spiFlash, 512M-bit, 4Kb Uniform Sector
Scheda dati
62A magazzino
Min: 1
Mult.: 1
Max.: 62

Serial NOR Flash 512 Mbit SOIC-16 W25M512JV SMD/SMT 104 MHz - 40 C + 85 C