Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.

Risultati: 6
Seleziona Immagine Codice Produttore Descrizione Scheda dati Disponibilità Prezzi (EUR) Filtra i risultati nella tabella per prezzo unitario in base alla quantità. Qtà RoHS Modello ECAD Prodotto Lunghezza Larghezza Altezza
Advanced Thermal Solutions Dissipatori Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x20mm 158A magazzino
Min: 1
Mult.: 1

Advanced Thermal Solutions Dissipatori Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x10mm 352A magazzino
Min: 1
Mult.: 1

BGA Heat Sink 54 mm 68 mm 20 mm
Advanced Thermal Solutions Dissipatori maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x9.76mm 93A magazzino
Min: 1
Mult.: 1

Advanced Thermal Solutions Dissipatori maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x25mm 104A magazzino
Min: 1
Mult.: 1

Advanced Thermal Solutions Dissipatori Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x10mm 86A magazzino
Min: 1
Mult.: 1

Advanced Thermal Solutions Dissipatori Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x20mm 29A magazzino
10027/03/2026 previsto
Min: 1
Mult.: 1