QFN Style Solder-Down Computer On Modules

Ka-Ro Electronics QFN Style Solder-Down Computer On Modules (COM) are single-sided assembled in a small square size of 27mm and a height of 2.6mm. These modules feature a QFN-type lead style with a 1mm pitch and 100 pads. The QFN-style solder-down modules are industrial-grade and include single-sided assembly and an RGB display interface. The QS91 modules feature an RGB display interface, a 2x USB connectivity, and Arm® Cortex®-A55, 1.4GHz NXP i.MX 91 processor. The QS93 modules feature an LVDS display interface with 2D GPU support and NXP i.MX 93 processor. The QFN-style solder-down modules are ideal for industrial, IoT, and medical applications.

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Qtà RoHS Modello ECAD Marca del processore
Tipo di processore
Chipset
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Massima capacità RAM
RAM installata
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Tipo di interfaccia
Temperatura di lavoro minima
Temperatura di lavoro massima
Dimensioni
Ka-Ro electronics Computer-On-Module - COM The QS91 is a solderable Sytem-on-Module with a size of only 27 by 27 mm.
Scheda dati
7A magazzino
Min: 1
Mult.: 1

ARM ARM Cortex-A55 32 kB, 32 kB, 256 kB 1.4 GHz 512 MB 3.3 V Ethernet, UART, USB - 25 C + 85 C
Ka-Ro electronics Computer-On-Module - COM QS91/SOCK is a socketed version of the QS91 Sytem-on-Module. QS00-SV04 needed.
Scheda dati
7A magazzino
Min: 1
Mult.: 1

NXP ARM Cortex-A55 i.MX 9131 1.4 GHz 512 MB 3.3 V - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Module - COM QS93/SOCK is a socketed version of the QS91 Sytem-on-Module. QS00-SV04 needed.
Scheda dati
7A magazzino
Min: 1
Mult.: 1

NXP ARM Cortex-A55, ARM Cortex-M33 i.MX 9352 1.7 GHz 3.3 V - 40 C + 85 C 27 mm x 27 mm x 2.3 mm